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TMX320F28069PNA

Texas Instruments

TMX320F28069PNA by Texas Instruments

TMX320F28069PNA by Texas Instruments is a 32-bit microcontroller with 80 MHz max clock frequency, 51200 RAM bytes, and 131072 ROM words. Ideal for industrial applications requiring ADC/DAC channels, PWM functionality, and DMA support. Package style: flatpack, low profile, fine pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,817 parts In-Stock

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Digiode

USA . 3,906 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 6 parts In-Stock

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AZTECH Wire

Italy . 424 parts In-Stock

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$11.609

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One Stop Electronics

USA . 1,203 parts In-Stock

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$25.000

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Parana Technologies

USA . 1,686 parts In-Stock

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$60.225

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DigiPath Technology Company

USA . 357 parts In-Stock

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$66.315

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$61.009

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IDEA Electronic Components Group

UK . 2,185 parts In-Stock

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$67.668

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$64.285

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$60.901

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ChromeModa Solutions

Germany . 810 parts In-Stock

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$67.668

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$55.488

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Corphita

USA . 4,061 parts In-Stock

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Lixinc

USA . 2,919 parts In-Stock

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Microchip USA

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Overview

Unlock the power of advanced technology with the Texas Instruments TMX320F28069PNA microcontroller. Manufactured by a trusted industry leader, this high-quality product offers unmatched performance and reliability for a wide range of applications. With its 32-bit architecture and versatile features like DAC and ADC channels, customers can experience seamless integration and enhanced functionality. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations and add value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the microcontroller, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 1.995 V

This allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

Package Shape: SQUARE

The square shape provides a compact form factor, making it easier to integrate into different systems and designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and data processing with speed and efficiency.

DAC Channels: YES

Digital-to-analog converters allow for precise control of analog signals, enabling the microcontroller to interface with sensors, actuators, and other analog devices.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages gives flexibility in system design and compatibility with different voltage requirements of peripherals.

No. of Terminals: 80

With a higher number of terminals, there are more options for connectivity and interfacing with external components, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles offer space-saving benefits, making it easier to incorporate the microcontroller into compact designs while ensuring efficient heat dissipation.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in harsh environments with elevated temperatures.

CPU Family: TMS320

Being part of the TMS320 CPU family means that this microcontroller benefits from proven performance, reliability, and a wide range of supporting software and tools.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the microcontroller can operate in extreme cold environments without compromising performance.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to read analog signals from sensors, enabling precise measurement and control in various applications.

DMA Channels: YES

Direct memory access channels allow for efficient data transfers without CPU intervention, enhancing system performance and responsiveness.

Terminal Position: QUAD

Quad-terminal positioning offers a standard and versatile configuration for easy PCB layout and mounting.

ROM Words: 131072

The large ROM capacity provides ample space for program storage, allowing for complex algorithms and applications to be implemented on the microcontroller.

Maximum Seated Height: 1.6 mm

The low seated height enables the microcontroller to be mounted in thin and compact devices, saving space and enabling sleek designs.

Width: 12 mm

The compact width of the microcontroller facilitates integration into space-constrained designs without sacrificing functionality.

Maximum Clock Frequency: 80 MHz

The high clock frequency allows for fast data processing and real-time operation, making the microcontroller suitable for high-speed applications.

Length: 12 mm

The short length of the microcontroller contributes to its compact form factor, making it ideal for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial environments with varying temperature conditions and harsh operating environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals and processing capabilities in a single chip, simplifying system design and reducing component count.

RAM Bytes: 51200

The generous RAM capacity provides ample space for data storage and processing, enabling efficient multitasking and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and PCB mounting, ensuring reliable electrical connections and mechanical stability.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a stable operating voltage for the microcontroller, ensuring consistent performance and reliability.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals, making the microcontroller suitable for applications requiring accurate pulse modulation.

ROM Programmability: FLASH

Flash programmability allows for easy and efficient updates to the microcontroller's firmware, enabling flexibility and future-proofing.

Terminal Pitch: 0.5 mm

The small terminal pitch offers high-density mounting options, allowing for more compact PCB layouts and miniaturized designs.

Speed: 80 rpm

With a maximum clock frequency of 80 MHz, this microcontroller can handle high-speed data processing and real-time applications with ease.

No. of I/O Lines: 40

Having 40 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers TMX320F28069PNA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

51200

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMX320F28069PNA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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