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TMX320F28377DPTPT

Texas Instruments

TMX320F28377DPTPT by Texas Instruments

TMX320F28377DPTPT by Texas Instruments is a 32-bit microcontroller with 176 I/O lines, DAC and ADC channels, and PWM support. Operating at up to 20 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package with low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,354 parts In-Stock

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Digiode

USA . 821 parts In-Stock

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Semicontronic

India . 1,121 parts In-Stock

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$6.000

100+ parts

$5.850

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$5.820

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1,121

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 778 parts In-Stock

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$11.004

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One Stop Electronics

USA . 241 parts In-Stock

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$19.000

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241

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Parana Technologies

USA . 1,961 parts In-Stock

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$45.865

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ChromeModa Solutions

Germany . 2,553 parts In-Stock

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$51.534

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$42.258

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IDEA Electronic Components Group

UK . 80 parts In-Stock

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$51.534

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$48.957

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$46.381

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80

$51.534

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$46.381

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Lixinc

USA . 15,841 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,489 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,316 parts In-Stock

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Corphita

USA . 2,776 parts In-Stock

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DigiPath Technology Company

USA . 1,538 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the TMX320F28377DPTPT microcontroller by Texas Instruments. Crafted with precision and expertise, this innovative device offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this high-quality microcontroller delivers superior functionality and efficiency. Experience the seamless integration and enhanced capabilities this product provides, making it the ideal choice for your next project. Trust Texas Instruments to bring you the best in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and compact placement of the microcontroller on a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interface with various sensors and devices.

DAC Channels: YES

DAC channels enable the microcontroller to convert digital data back to analog signals, facilitating controlled output to external devices such as actuators or displays.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures that the microcontroller can function reliably in challenging environments or applications where heat may be a concern.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer between peripherals and memory without involving the CPU, improving overall system performance.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling firmware updates and flexibility in design without requiring specialized equipment.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency enables fast processing and response times, making this microcontroller suitable for applications that require quick and precise control.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the microcontroller energy-efficient and versatile.

Technical Specifications

Microcontrollers TMX320F28377DPTPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

176

No. of Terminals:

176

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMX320F28377DPTPT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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