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TMX320F28023DAA

Texas Instruments

TMX320F28023DAA by Texas Instruments

TMX320F28023DAA by Texas Instruments is a 32-bit DSP with 1.71-1.995V supply, 40MHz clock speed, and 32768 ROM words. Ideal for industrial applications, it features a small outline package with dual terminals and boundary scan capability for efficient digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,966 parts In-Stock

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4,966

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Vyrian

USA . 4,854 parts In-Stock

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4,854

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Distributors (Availability)

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AZTECH Wire

Italy . 810 parts In-Stock

1+ parts

$11.961

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810

$11.961

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One Stop Electronics

USA . 419 parts In-Stock

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$30.000

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419

$30.000

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Parana Technologies

USA . 1,653 parts In-Stock

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$38.670

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$38.670

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

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$43.449

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$41.277

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$39.104

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2,187

$43.449

$41.277

$39.104

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ChromeModa Solutions

Germany . 1,904 parts In-Stock

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$43.449

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$35.628

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1,904

$43.449

$35.628

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Corohmni

South Africa . 26 parts In-Stock

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$48.096

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26

$48.096

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Component Stockers USA

USA . 618 parts In-Stock

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$99.990

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618

$99.990

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A-Z Elektronik GmbH

Germany . 6,044 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,903 parts In-Stock

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Microchip USA

USA . 2,283 parts In-Stock

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DigiPath Technology Company

USA . 505 parts In-Stock

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$39.174

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Overview

Enhance your digital signal processing capabilities with the TMX320F28023DAA by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this DSP offers unmatched performance in a compact package. Ideal for a wide range of applications, from telecommunications to industrial automation, this powerful processor delivers exceptional value and benefits to customers. Stay ahead of the curve and unlock new possibilities with the TMX320F28023DAA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.995 V

Higher maximum supply voltage allows for better performance and stability in different operating conditions.

Package Shape: RECTANGULAR

Rectangular package shape ensures easy integration and compact design for space-constrained applications.

Bit Size: 32

With a 32-bit architecture, the DSP delivers high processing power and efficiency for handling complex algorithms and tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages gives flexibility in design and operation, ensuring compatibility with various systems.

No. of Terminals: 38

Having a sufficient number of terminals allows for easy connectivity and interface with other components in the system.

Minimum Supply Voltage: 1.71 V

Lower minimum supply voltage ensures energy efficiency and extended battery life in portable or low-power devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the DSP suitable for industrial environments with varying thermal conditions.

CPU Family: TMS320

Being part of the TMS320 CPU family, the DSP inherits a legacy of reliable and optimized signal processing performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the DSP to function reliably in harsh cold environments without failure.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity for reliable data transmission.

ROM Words: 32768

Large ROM capacity allows for storing extensive program code and data, enabling versatile functionality and customization.

Maximum Seated Height: 1.2 mm

Low seated height facilitates a slim and compact design for space-saving and lightweight applications.

Width: 6.1 mm

Narrow width dimensions make the DSP suitable for compact electronic devices and PCB layouts with limited space.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, ensuring efficient manufacturing and maintenance.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast and efficient signal processing operations, making the DSP suitable for real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and system performance, supporting complex computations and algorithms.

Length: 12.5 mm

Compact length dimensions offer flexibility in product design and integration, catering to various form factors and applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding environments with elevated temperature fluctuations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports diverse applications and interfaces, expanding the DSP's connectivity and functionality.

RAM Bytes: 12288

Large RAM capacity allows for efficient memory management and data processing, enhancing the DSP's performance and versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in various environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly onto PCBs, ensuring secure and reliable electrical connections.

Nominal Supply Voltage: 1.8 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the DSP in different power conditions.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware upgrades and customization, enhancing the flexibility and adaptability of the DSP.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density PCB layouts and compact designs, optimizing space utilization and miniaturization.

Format: FIXED POINT

Fixed-point format enhances computational efficiency and precision, making the DSP suitable for real-time signal processing applications.

Speed: 40 rpm

High processing speed of 40 rpm ensures fast and efficient data processing, enabling real-time response and high-performance computing.

Low Power Mode: YES

Low power mode option enables energy-saving operation, extending battery life and reducing power consumption in power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMX320F28023DAA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G38

Length:

12.5 mm

Low Power Mode:

YES

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

TMX320F28023DAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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