Loading...

TMX320C6472CZTZ

Texas Instruments

TMX320C6472CZTZ by Texas Instruments

TMX320C6472CZTZ by Texas Instruments is a 32-bit DSP with 737 terminals, operating at up to 500 MHz. It features a 14-bit address bus width and 8192 RAM words. Ideal for applications requiring high-speed digital signal processing in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,600

-

-

-

-

Digiode

USA . 1,867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$7.271

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$7.271

-

-

-

Corohmni

South Africa . 1,016 parts In-Stock

1+ parts

$28.874

100+ parts

-

1k+ parts

-

10k+ parts

-

1,016

$28.874

-

-

-

One Stop Electronics

USA . 1,142 parts In-Stock

1+ parts

$33.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,142

$33.000

-

-

-

Parana Technologies

USA . 1,305 parts In-Stock

1+ parts

$64.639

100+ parts

-

1k+ parts

-

10k+ parts

-

1,305

$64.639

-

-

-

DigiPath Technology Company

USA . 1,728 parts In-Stock

1+ parts

$71.175

100+ parts

$65.481

1k+ parts

-

10k+ parts

-

1,728

$71.175

$65.481

-

-

ChromeModa Solutions

Germany . 4,035 parts In-Stock

1+ parts

$72.628

100+ parts

$59.555

1k+ parts

-

10k+ parts

-

4,035

$72.628

$59.555

-

-

IDEA Electronic Components Group

UK . 901 parts In-Stock

1+ parts

$72.628

100+ parts

$68.997

1k+ parts

$65.365

10k+ parts

-

901

$72.628

$68.997

$65.365

-

Component Stockers USA

USA . 637 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

637

$99.990

-

-

-

Corphita

USA . 1,099 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

-

-

-

-

Microchip USA

USA . 497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

497

-

-

-

-

Overview

Elevate your digital signal processing projects with the TMX320C6472CZTZ from Texas Instruments. This high-quality DSP offers unparalleled performance and reliability, thanks to its advanced technology and innovative design. Whether you're working on audio processing, telecommunications, or industrial control applications, this powerful DSP will surpass your expectations. Trust in Texas Instruments' expertise to deliver exceptional value and benefits to your projects, setting you apart from the competition. With the TMX320C6472CZTZ, the possibilities are endless.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and improving reliability.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V helps in reducing power consumption and heat generation.

Address Bus Width: 14

With a wider address bus width of 14, the DSP can access larger memory spaces and handle more complex data processing tasks efficiently.

Package Shape: SQUARE

The square package shape offers a compact design, making it suitable for space-constrained applications.

Bit Size: 32

A 32-bit architecture allows for high-speed data processing and complex calculations, making the DSP suitable for demanding applications.

Power Supplies (V): 1.2,1.5/1.8,1.8,3.3

Having multiple power supply options allows for flexibility in different voltage requirements, ensuring compatibility with various systems.

No. of Terminals: 737

With a high number of terminals, the DSP can support a wide range of connections and peripherals, enhancing its versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provide a secure and reliable connection, ensuring stable performance in challenging environments.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95 V ensures power efficiency and extends the product's battery life.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the DSP can operate reliably in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C enables the DSP to function in cold environments without performance limitations.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easy and secure mounting on the PCB, ensuring stable connections for uninterrupted operation.

Maximum Seated Height: 3.242 mm

A low maximum seated height of 3.242 mm allows for a slim profile, making the DSP suitable for compact devices and applications.

RAM Words: 8192

With a large RAM capacity of 8192 words, the DSP can store and manipulate a significant amount of data efficiently, enhancing performance.

Width: 24 mm

A compact width of 24 mm makes the DSP suitable for space-constrained designs without compromising on functionality.

Boundary Scan: YES

Having boundary scan capability allows for comprehensive testing and debugging of the DSP, ensuring quality and reliability in operation.

External Data Bus Width: 32

A wide external data bus width of 32 allows for high-speed data transfer and efficient communication with external devices, enhancing overall system performance.

Maximum Clock Frequency: 500 MHz

Operating at a maximum clock frequency of 500 MHz enables fast processing speeds and responsive performance for time-critical applications.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures improves data throughput and system efficiency, enabling the DSP to handle complex tasks with ease.

Length: 24 mm

A compact length of 24 mm contributes to a small form factor, making the DSP suitable for embedded systems and portable devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting various types of peripheral ICs enhances the DSP's connectivity and compatibility with different devices and systems, expanding its functionality.

Technology: CMOS

Built on CMOS technology, the DSP offers low power consumption, high speed, and reliable operation, making it ideal for battery-powered and energy-efficient applications.

Terminal Form: BALL

Ball terminals provide a secure and reliable connection, facilitating easy soldering and ensuring stable performance in demanding environments.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1 V ensures compatibility with standard power sources and efficient power management for optimized performance.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the DSP offers high-density packaging, saving space on the PCB and enabling compact design solutions.

Format: FIXED POINT

Using fixed-point format simplifies calculations and reduces complexity, making the DSP suitable for real-time signal processing tasks with low latency.

Low Power Mode: YES

Enabled with low power mode, the DSP can operate efficiently in power-constrained environments, extending battery life and reducing energy consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C6472CZTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V I/O SUPPLY

Address Bus Width:

14

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

500 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B737

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

737

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA737,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,1.5/1.8,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMX320C6472CZTZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20