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TMS62256L-15DH

Texas Instruments

TMS62256L-15DH by Texas Instruments

TMS62256L-15DH by Texas Instruments is a 32Kx8 SRAM with 150ns access time, operating at 5V. It features 3-STATE output and consumes max 15mA supply current. Ideal for commercial applications requiring fast and reliable memory storage in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,584

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Digiode

USA . 3,097 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,097

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 956 parts In-Stock

1+ parts

$3.176

100+ parts

-

1k+ parts

$3.698

10k+ parts

-

956

$3.176

-

$3.698

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DigiPath Technology Company

USA . 1,393 parts In-Stock

1+ parts

$3.498

100+ parts

-

1k+ parts

-

10k+ parts

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1,393

$3.498

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-

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IDEA Electronic Components Group

UK . 974 parts In-Stock

1+ parts

$3.569

100+ parts

-

1k+ parts

$3.212

10k+ parts

-

974

$3.569

-

$3.212

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ChromeModa Solutions

Germany . 155 parts In-Stock

1+ parts

$3.569

100+ parts

$2.927

1k+ parts

-

10k+ parts

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155

$3.569

$2.927

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AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$5.096

100+ parts

-

1k+ parts

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10k+ parts

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247

$5.096

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One Stop Electronics

USA . 370 parts In-Stock

1+ parts

$13.000

100+ parts

-

1k+ parts

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370

$13.000

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Corphita

USA . 2,116 parts In-Stock

1+ parts

-

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2,116

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Overview

Unleash the power of cutting-edge technology with the TMS62256L-15DH by Texas Instruments. As a leader in the industry, Texas Instruments has crafted this SRAM with precision and quality in mind, ensuring top-notch performance and reliability. Whether used in industrial, automotive, or consumer electronics applications, this memory IC offers unparalleled speed and efficiency. Experience seamless operation and improved functionality with the TMS62256L-15DH, setting new standards for memory solutions. Elevate your projects to the next level with this innovative product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation on circuit boards, saving space.

Operating Mode: ASYNCHRONOUS

The asynchronous operation mode allows for fast and efficient data transfer without the need for a clock signal.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of devices and systems.

Organization: 32KX8

With an organization of 32KX8, this SRAM chip offers a high density of memory storage in a compact form factor.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed performance, making it energy efficient.

Maximum Access Time: 150 ns

The fast maximum access time of 150 ns ensures quick data retrieval, improving overall system performance.

Technical Specifications

SRAM TMS62256L-15DH attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.00005 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

15 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS62256L-15DH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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