Loading...

TMS62256L-85DH

Texas Instruments

TMS62256L-85DH by Texas Instruments

TMS62256L-85DH by Texas Instruments is a 32Kx8 SRAM with 85ns access time, operating at 5V. It features a small outline package, common I/O type, and 3-state output characteristics. Ideal for commercial applications requiring fast and reliable memory storage in devices like consumer electronics and industrial equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,382

-

-

-

-

Vyrian

USA . 3,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,430

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,123 parts In-Stock

1+ parts

$4.935

100+ parts

$458.294

1k+ parts

$4.442

10k+ parts

-

2,123

$4.935

$458.294

$4.442

-

DigiPath Technology Company

USA . 2,272 parts In-Stock

1+ parts

$5.434

100+ parts

-

1k+ parts

-

10k+ parts

-

2,272

$5.434

-

-

-

ChromeModa Solutions

Germany . 2,792 parts In-Stock

1+ parts

$5.545

100+ parts

$4.547

1k+ parts

-

10k+ parts

-

2,792

$5.545

$4.547

-

-

IDEA Electronic Components Group

UK . 1,866 parts In-Stock

1+ parts

$5.545

100+ parts

-

1k+ parts

$4.990

10k+ parts

-

1,866

$5.545

-

$4.990

-

AZTECH Wire

Italy . 419 parts In-Stock

1+ parts

$17.074

100+ parts

-

1k+ parts

-

10k+ parts

-

419

$17.074

-

-

-

One Stop Electronics

USA . 768 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

768

$24.000

-

-

-

Corphita

USA . 4,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,169

-

-

-

-

Overview

Elevate your projects with the TMS62256L-85DH by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality SRAM products designed for various applications. This small-outline memory IC offers a reliable and efficient solution with 32Kx8 organization and 85 ns maximum access time. With its common I/O type and 3-state output characteristics, this device ensures seamless integration into your designs. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides good protection for the internal components of the SRAM.

Surface Mount: YES

Makes it easy to integrate the SRAM into a variety of circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage requirements in many electronic devices.

Organization: 32KX8

Efficient organization of memory storage allows for quick and easy access to data.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance.

Maximum Access Time: 85 ns

Fast access time ensures quick retrieval of information from the SRAM.

Technical Specifications

SRAM TMS62256L-85DH attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

Maximum Access Time:

85 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.00005 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

15 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS62256L-85DH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19