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TMS320DM8148CCYE1

Texas Instruments

TMS320DM8148CCYE1 by Texas Instruments

TMS320DM8148CCYE1 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit external data bus width, and 72 DMA channels. It is used in applications requiring high processing speed at low power consumption, such as embedded systems and industrial automation.

Median Price

$104.350

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 329 parts In-Stock

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$65.862

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$58.544

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$43.047

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$65.862

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DigiKey

USA . 112 parts In-Stock

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$104.350

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$80.147

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$78.162

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$104.350

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$78.162

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Mouser Electronics

USA . 69 parts In-Stock

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$104.350

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$80.150

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69

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Distributors (In-Stock)

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Digiode

USA . 1,676 parts In-Stock

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$62.569

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Vyrian

USA . 5,027 parts In-Stock

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Chip Stock

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

France . 13 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,289 parts In-Stock

1+ parts

$56.783

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2,289

$56.783

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Corphita

USA . 4,528 parts In-Stock

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$59.276

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DigiPath Technology Company

USA . 775 parts In-Stock

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$62.525

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ChromeModa Solutions

Germany . 4,608 parts In-Stock

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$63.801

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$52.317

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4,608

$63.801

$52.317

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IDEA Electronic Components Group

UK . 2,246 parts In-Stock

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$63.801

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$60.611

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$57.421

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2,246

$63.801

$60.611

$57.421

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Lixinc

USA . 14,152 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,380 parts In-Stock

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GreenTree Electronics

Israel . 1,260 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 57 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320DM8148CCYE1 microprocessor by Texas Instruments. This top-of-the-line product boasts unparalleled quality and reliability, making it the perfect choice for a wide range of applications. Whether you're looking to enhance your system's performance or streamline your operations, this microprocessor delivers exceptional value and benefits. Experience seamless functionality, high-speed processing, and unmatched efficiency with the TMS320DM8148CCYE1 - the ultimate solution for all your computing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making this microprocessor ideal for portable devices.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance of the microprocessor by reducing the access time to frequently used data.

Maximum Supply Voltage: 1.42 V

The maximum supply voltage of 1.42 V ensures stable operation of the microprocessor without risking damage due to overvoltage.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width of 8 allows for faster data transfer and processing within the microprocessor.

Address Bus Width: 28

A wider address bus width of 28 enables the microprocessor to access a larger memory space, allowing for more complex computations and operations.

Package Shape: SQUARE

The square package shape makes it easier for the microprocessor to be mounted on circuit boards, optimizing space utilization in electronic devices.

Bit Size: 32

With a bit size of 32, this microprocessor is capable of handling larger and more complex data sets, making it suitable for high-performance computing tasks.

Power Supplies (V): 0.95/1.35

The availability of multiple power supply options allows for flexibility in designing and configuring the microprocessor for different power requirements.

No. of Terminals: 684

The high number of terminals provides ample connectivity options for interfacing the microprocessor with other components in a system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enhances the reliability of the microprocessor connections, ensuring stable and efficient operation.

Minimum Supply Voltage: 1.28 V

The minimum supply voltage of 1.28 V ensures that the microprocessor can operate efficiently even at lower power levels, conserving energy.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the microprocessor to function reliably in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the microprocessor can startup and operate effectively in cold environments as well.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper for terminal finish provides good conductivity and corrosion resistance, enhancing the longevity of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom makes it easier to integrate the microprocessor into a circuit board layout, simplifying the assembly process.

Maximum Seated Height: 3.06 mm

The low maximum seated height allows for slim and compact electronic device designs when integrating this microprocessor.

RAM Words: 16384

With a large number of RAM words available, the microprocessor can efficiently store and process data, improving overall performance.

Width: 23 mm

The compact width of 23 mm makes this microprocessor suitable for space-constrained applications where size is a critical factor.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing and maintenance processes.

External Data Bus Width: 16

The external data bus width of 16 allows for high-speed data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency of 30 MHz enables the microprocessor to execute instructions quickly, making it suitable for real-time processing applications.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C ensures that the microprocessor can withstand the soldering process during assembly without being damaged.

Length: 23 mm

The compact length of 23 mm complements the width, making this microprocessor ideal for small form factor electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor type, this product offers high processing efficiency and lower power consumption, making it suitable for energy-efficient applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor efficient and reliable in various operating conditions.

Terminal Form: BALL

Having ball terminal form makes it easier to solder and connect the microprocessor to the circuit board, ensuring secure and reliable connections.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35 V provides a stable operating voltage for the microprocessor, ensuring consistent performance across different operating conditions.

No. of DMA Channels: 72

The high number of DMA channels allows for efficient data transfer and processing, improving overall system performance and throughput.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables a high density of terminals and compact packaging, making this microprocessor suitable for space-constrained designs.

Format: FLOATING POINT

Being a floating-point format microprocessor enables high precision calculations and support for complex mathematical operations, making it suitable for scientific and engineering applications.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the microprocessor requires special handling during storage and assembly to prevent moisture-related damage.

Speed: 1000 rpm

With a high speed of 1000 rpm, this microprocessor can process instructions quickly, enhancing system performance in real-time and high-speed computing applications.

Low Power Mode: YES

The availability of a low power mode allows the microprocessor to operate in a power-efficient state when not performing intensive tasks, saving energy and extending battery life in portable devices.

Technical Specifications

Microprocessors TMS320DM8148CCYE1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8148CCYE1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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