Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TMS320DM8148CCYE1 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit external data bus width, and 72 DMA channels. It is used in applications requiring high processing speed at low power consumption, such as embedded systems and industrial automation.
Median Price
$114.040
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8
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1k+
Texas Instruments
1+ parts
$65.862
100+ parts
$58.544
1k+ parts
$43.047
10k+ parts
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DigiKey
$87.927
Mouser Electronics
$87.930
Digiode
$62.569
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Chip Stock
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ACDS - Activité Composants Distribution Service
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$56.783
Corphita
$59.276
DigiPath Technology Company
$62.525
ChromeModa Solutions
$63.801
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IDEA Electronic Components Group
$60.611
$57.421
Lixinc
A-Z Elektronik GmbH
GreenTree Electronics
Perfect Parts
Kepictronics
PLASTIC/EPOXY material is lightweight and durable, making this microprocessor ideal for portable devices.
Having integrated cache helps in improving the overall performance of the microprocessor by reducing the access time to frequently used data.
The maximum supply voltage of 1.42 V ensures stable operation of the microprocessor without risking damage due to overvoltage.
Having a wider on-chip data RAM width of 8 allows for faster data transfer and processing within the microprocessor.
A wider address bus width of 28 enables the microprocessor to access a larger memory space, allowing for more complex computations and operations.
The square package shape makes it easier for the microprocessor to be mounted on circuit boards, optimizing space utilization in electronic devices.
With a bit size of 32, this microprocessor is capable of handling larger and more complex data sets, making it suitable for high-performance computing tasks.
The availability of multiple power supply options allows for flexibility in designing and configuring the microprocessor for different power requirements.
The high number of terminals provides ample connectivity options for interfacing the microprocessor with other components in a system.
The grid array, fine pitch package style enhances the reliability of the microprocessor connections, ensuring stable and efficient operation.
The minimum supply voltage of 1.28 V ensures that the microprocessor can operate efficiently even at lower power levels, conserving energy.
The high maximum operating temperature allows the microprocessor to function reliably in various environmental conditions without overheating.
The low minimum operating temperature ensures that the microprocessor can startup and operate effectively in cold environments as well.
The use of tin, silver, and copper for terminal finish provides good conductivity and corrosion resistance, enhancing the longevity of the microprocessor.
Having terminals positioned at the bottom makes it easier to integrate the microprocessor into a circuit board layout, simplifying the assembly process.
The low maximum seated height allows for slim and compact electronic device designs when integrating this microprocessor.
With a large number of RAM words available, the microprocessor can efficiently store and process data, improving overall performance.
The compact width of 23 mm makes this microprocessor suitable for space-constrained applications where size is a critical factor.
Having boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing and maintenance processes.
The external data bus width of 16 allows for high-speed data transfer between the microprocessor and external devices, enhancing overall system performance.
The high maximum clock frequency of 30 MHz enables the microprocessor to execute instructions quickly, making it suitable for real-time processing applications.
The high peak reflow temperature of 250°C ensures that the microprocessor can withstand the soldering process during assembly without being damaged.
The compact length of 23 mm complements the width, making this microprocessor ideal for small form factor electronic devices.
Being a RISC microprocessor type, this product offers high processing efficiency and lower power consumption, making it suitable for energy-efficient applications.
CMOS technology offers low power consumption and high noise immunity, making this microprocessor efficient and reliable in various operating conditions.
Having ball terminal form makes it easier to solder and connect the microprocessor to the circuit board, ensuring secure and reliable connections.
The nominal supply voltage of 1.35 V provides a stable operating voltage for the microprocessor, ensuring consistent performance across different operating conditions.
The high number of DMA channels allows for efficient data transfer and processing, improving overall system performance and throughput.
The small terminal pitch of 0.8 mm enables a high density of terminals and compact packaging, making this microprocessor suitable for space-constrained designs.
Being a floating-point format microprocessor enables high precision calculations and support for complex mathematical operations, making it suitable for scientific and engineering applications.
Having a moisture sensitivity level of 4 indicates that the microprocessor requires special handling during storage and assembly to prevent moisture-related damage.
With a high speed of 1000 rpm, this microprocessor can process instructions quickly, enhancing system performance in real-time and high-speed computing applications.
The availability of a low power mode allows the microprocessor to operate in a power-efficient state when not performing intensive tasks, saving energy and extending battery life in portable devices.
Microprocessors TMS320DM8148CCYE1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of DMA Channels:
No. of Terminals:
On Chip Data RAM Width:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
RAM Words:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
TMS320DM8148CCYE1 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - DM81(2,4)x, DRA64x, AM387x, DM814xSEC 01/May/2013 Datasheet Update 28/Apr/2014
PCN Assembly/Origin - Assembly Site 21/Oct/2022
PCN Packaging - BGA Devices 04/Apr/2017 BGA Devices 12/May/2017
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
STM32F405RGT6TR
STMicroelectronics
STM32F405RGT6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 26 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
LM358DT
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
BSS138BKW,115
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Diotec Semiconductor Ag
Gec Plessey Semiconductors
BAV99WT1G
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
MPC8270ZQMIBA
The NXP Semiconductors MPC8270ZQMIBA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 266 MHz, making it suitable for high-speed computing applications. With a package style of grid array and terminal finish of tin lead silver, this processor is ideal for commercial-grade systems requiring efficient processing power in a compact form factor.
AM3351BZCEA60
AM3351BZCEA60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, making it ideal for compact designs with a terminal pitch of 0.65 mm.
ATSAMA5D35A-CN
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
P2041NXN7NNC
The NXP Semiconductors P2041NXN7NNC microprocessor features 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications, it operates at temperatures ranging from -40 to 105°C with low power mode support.
MCF5206ECAB40
The NXP Semiconductors MCF5206ECAB40 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 40 MHz. Ideal for industrial applications, it has a temperature range from -40 to 85°C and supports low power mode for energy efficiency.
MC7448VU1400ND
MC7448VU1400ND by NXP Semiconductors is a 32-bit microprocessor with max clock frequency of 1400 MHz. Operating at low power mode, it has a package style of grid array and supports supply voltages ranging from 1.1V to 1.3V. Ideal for applications requiring high-speed processing in compact devices.
MCF5485CVR200
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
MC8640DTVJ1250HE
MC8640DTVJ1250HE by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max frequency of 166.66 MHz. Ideal for industrial applications, it features a ceramic package body, boundary scan capability, and supports floating-point format computations.
MCF5307AI90B
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
CM8063701098702SR0PA
Intel
Intel CM8063701098702SR0PA is a 64-bit microprocessor with 1155 terminals. It operates at a speed of 3500 rpm and features integrated cache. Suitable for various applications requiring high processing power in a square package shape.
XAM3359ZCZ
XAM3359ZCZ by Texas Instruments is a RISC microprocessor with CMOS technology. It has a peak reflow temperature of 260°C and can withstand up to 30s at this temperature. Ideal for applications requiring high processing power in compact devices.
MCF5251CVM140
NXP Semiconductors' MCF5251CVM140 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing in a compact square package with ball terminals.
MC7455ARX733LG
Motorola
Motorola MC7455ARX733LG microprocessor features 32-bit architecture with 64-bit external data bus, operating at a max clock frequency of 133 MHz. With integrated cache and low power mode, it is ideal for high-performance computing applications requiring fast processing speeds and efficient power consumption. The package style in grid array format makes it suitable for compact electronic devices where space-saving design is crucial.
MPC8321ECVRADDCA
NXP Semiconductors' MPC8321ECVRADDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. This CMOS technology chip features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices.
MC9S08PT16VLD
MC9S08PT16VLD by NXP is an 8-bit microprocessor with 16384 ROM words, 2048 RAM bytes, and a max clock frequency of 20 MHz. Ideal for industrial applications, it operates b/w -40 to 105 °C with low power mode and flash ROM programmability.
ATSAMA5D36A-CU
MPC880VR66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
STM32MP135FAE7
STM32MP135FAE7 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It operates at a max clock frequency of 48 MHz, suitable for low power applications like IoT devices and wearables. With 289 terminals in a grid array package style, it offers high performance in a compact form factor.
STM32MP135CAG3
STM32MP135CAG3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words, 48 MHz clock frequency, and 56 DMA channels. It is used in applications requiring a RISC peripheral IC with low power mode, such as IoT devices and embedded systems.
MC7448HX1400ND
The NXP Semiconductors MC7448HX1400ND is a 32-bit microprocessor with a max clock frequency of 1400 MHz. It operates at a voltage range of 1.1V to 1.3V and features low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices due to its small package size and ceramic, metal-sealed co-fired body material.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TMS320DM8147SCYE1
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;
TMS320DM8148CCYEA0
TMS320DM8148CCYEA0 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power mode applications. With 72 DMA channels, it offers high-speed processing in various embedded systems.
TMS320DM8147SCYE0
TMS320DM8148CCYE0
TMS320DM8147BCYE1
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
TMS320DM8148CCYE2
TMS320DM8127BCYE2
TMS320C6474FZUNA2
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Low Power Mode: YES;
TMS320DM8127BCYE3L
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: HBGA; Package Shape: SQUARE;
TMS320DM8127BCYED1
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;
TMS320C6474FGUN
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE;
TMS320C6474FZUN
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
TMS320C6A8167BCYG4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1031; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
TMS320DM8127BCYE1
TMS320C6474FZUNA
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.2 V;
TMS320DM8127BCYE3
TMS320C6474FGUNA
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE;
TMS320C6A8167CYG
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1031; Package Code: FBGA; Package Shape: SQUARE;
TMS320C6474FZUN2
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.1 V;
TMS320C6A8168ACYG2
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