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TMS320DM8127SCYED3

Texas Instruments

TMS320DM8127SCYED3 by Texas Instruments

TMS320DM8127SCYED3 by Texas Instruments is a 32-bit microprocessor with 8-word data RAM, 16-bit external data bus width, and max clock frequency of 30 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$87.344

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 951 parts In-Stock

1+ parts

$72.849

100+ parts

$64.755

1k+ parts

$47.614

10k+ parts

-

951

$72.849

$64.755

$47.614

-

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$101.840

100+ parts

$77.740

1k+ parts

-

10k+ parts

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2

$101.840

$77.740

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,283 parts In-Stock

1+ parts

$69.207

100+ parts

-

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-

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4,283

$69.207

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Vyrian

USA . 5,789 parts In-Stock

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-

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5,789

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,155 parts In-Stock

1+ parts

$65.009

100+ parts

-

1k+ parts

-

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1,155

$65.009

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-

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Corphita

USA . 894 parts In-Stock

1+ parts

$65.564

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-

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894

$65.564

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-

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

$71.583

100+ parts

$65.856

1k+ parts

-

10k+ parts

-

1,057

$71.583

$65.856

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-

ChromeModa Solutions

Germany . 1,835 parts In-Stock

1+ parts

$73.044

100+ parts

$59.896

1k+ parts

-

10k+ parts

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1,835

$73.044

$59.896

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IDEA Electronic Components Group

UK . 1,230 parts In-Stock

1+ parts

$73.044

100+ parts

$69.392

1k+ parts

$65.740

10k+ parts

-

1,230

$73.044

$69.392

$65.740

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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3,500

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Component Stockers USA

USA . 129 parts In-Stock

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129

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Overview

Experience unmatched performance and reliability with the TMS320DM8127SCYED3 by Texas Instruments, a leading manufacturer in the industry. This microprocessor is designed to meet your highest expectations with integrated cache, advanced technology, and industrial-grade temperature tolerance. Ideal for a wide range of applications, this powerful processor offers customers exceptional value, benefits, and advantages. Trust Texas Instruments to deliver cutting-edge solutions that exceed your demands.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the efficiency and speed of the microprocessor by allowing for faster access to frequently used data.

Maximum Supply Voltage: 1.42 V

Operating at a maximum supply voltage of 1.42 V allows for higher performance while still maintaining power efficiency.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, the microprocessor can efficiently handle and process data.

Address Bus Width: 28

A wider address bus width of 28 allows the microprocessor to access a larger range of memory locations, improving overall performance.

Package Shape: SQUARE

The square package shape allows for easier placement and integration into circuit boards, saving space and enhancing design flexibility.

Bit Size: 32

A bit size of 32 provides sufficient processing power and capability for a wide range of applications.

No. of Terminals: 684

Having 684 terminals provides connectivity options and interfaces for multiple components, allowing for versatile use in complex systems.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER offers good conductivity and corrosion resistance, ensuring reliable connections.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90 °C, the microprocessor can withstand increased heat levels, suitable for industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it provides efficient data processing and execution capabilities, ideal for high-performance computing tasks.

Technical Specifications

Microprocessors TMS320DM8127SCYED3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

851968

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127SCYED3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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