Loading...

TMS320DM8127SCYE1

Texas Instruments

TMS320DM8127SCYE1 by Texas Instruments

TMS320DM8127SCYE1 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit external data bus width, and max clock frequency of 30 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and telecommunications.

Median Price

$60.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 39 parts In-Stock

1+ parts

$60.990

100+ parts

$54.214

1k+ parts

$39.863

10k+ parts

-

39

$60.990

$54.214

$39.863

-

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$57.290

1k+ parts

$51.260

10k+ parts

$48.250

60

-

$57.290

$51.260

$48.250

DigiKey

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$71.612

1k+ parts

$64.075

10k+ parts

$60.313

60

-

$71.612

$64.075

$60.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 749 parts In-Stock

1+ parts

$52.602

100+ parts

-

1k+ parts

-

10k+ parts

-

749

$52.602

-

-

-

Vyrian

USA . 5,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,112

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$47.060

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$47.060

-

-

-

Corphita

USA . 805 parts In-Stock

1+ parts

$49.833

100+ parts

-

1k+ parts

-

10k+ parts

-

805

$49.833

-

-

-

Parana Technologies

USA . 1,145 parts In-Stock

1+ parts

$49.891

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

$49.891

-

-

-

ChromeModa Solutions

Germany . 1,983 parts In-Stock

1+ parts

$56.057

100+ parts

$45.967

1k+ parts

-

10k+ parts

-

1,983

$56.057

$45.967

-

-

IDEA Electronic Components Group

UK . 1,529 parts In-Stock

1+ parts

$56.057

100+ parts

$53.254

1k+ parts

$50.451

10k+ parts

-

1,529

$56.057

$53.254

$50.451

-

Component Stockers USA

USA . 75 parts In-Stock

1+ parts

$57.270

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$57.270

-

-

-

Microchip USA

USA . 1,008 parts In-Stock

1+ parts

$135.820

100+ parts

$133.450

1k+ parts

$132.270

10k+ parts

$131.090

1,008

$135.820

$133.450

$132.270

$131.090

QUARKTWIN TECHNOLOGY LTD

USA . 28,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,159

-

-

-

-

DigiPath Technology Company

USA . 1,292 parts In-Stock

1+ parts

-

100+ parts

$50.541

1k+ parts

-

10k+ parts

-

1,292

-

$50.541

-

-

Overview

Experience the power of innovation with the TMS320DM8127SCYE1 by Texas Instruments, a cutting-edge microprocessor designed to deliver top-notch performance and reliability. With Texas Instruments' renowned reputation for quality and excellence, this microprocessor is ideal for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. Unlock the potential of your designs with integrated cache, advanced technology, and low power mode, providing unmatched value and benefits to customers seeking high-performance solutions. Choose Texas Instruments for superior quality and seamless integration in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.26 V

Efficient power management with a relatively low maximum supply voltage.

On Chip Data RAM Width: 8

Having a width of 8 for on-chip data RAM allows for faster data processing and storage.

Address Bus Width: 28

A wider address bus width of 28 enables the microprocessor to access a larger memory space.

No. of Terminals: 684

A higher number of terminals provide more connectivity options and functionality for the microprocessor.

Bit Size: 32

A 32-bit architecture allows for faster processing speed and handling of larger data sets.

Peripheral IC Type: MICROPROCESSOR, RISC

Using RISC architecture in the peripheral IC type ensures efficient and optimized performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an energy-efficient choice.

Speed: 1000 rpm

Operating at a speed of 1000 rpm ensures quick response times and high performance for the microprocessor.

Technical Specifications

Microprocessors TMS320DM8127SCYE1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

851968

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127SCYE1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20