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TMS320C6726BRFP266

Texas Instruments

TMS320C6726BRFP266 by Texas Instruments

TMS320C6726BRFP266 by Texas Instruments is a 32-bit DSP with integrated cache, 262144 RAM words, and 25 MHz max clock frequency. Ideal for digital signal processing applications requiring high-speed data processing in a compact form factor.

Median Price

$27.504

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 38 parts In-Stock

1+ parts

$6.830

100+ parts

$6.748

1k+ parts

$6.713

10k+ parts

-

38

$6.830

$6.748

$6.713

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Verical

USA . 38 parts In-Stock

1+ parts

$6.830

100+ parts

-

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-

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38

$6.830

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-

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Texas Instruments

USA . 980 parts In-Stock

1+ parts

$24.007

100+ parts

$20.970

1k+ parts

$14.462

10k+ parts

-

980

$24.007

$20.970

$14.462

-

Chip1Stop

Japan . 90 parts In-Stock

1+ parts

$31.000

100+ parts

$24.300

1k+ parts

$22.500

10k+ parts

$21.700

90

$31.000

$24.300

$22.500

$21.700

Mouser Electronics

USA . 66 parts In-Stock

1+ parts

$33.630

100+ parts

$24.520

1k+ parts

$22.970

10k+ parts

-

66

$33.630

$24.520

$22.970

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DigiKey

USA . 38 parts In-Stock

1+ parts

$33.630

100+ parts

$24.513

1k+ parts

$22.976

10k+ parts

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38

$33.630

$24.513

$22.976

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,696 parts In-Stock

1+ parts

$11.466

100+ parts

-

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2,696

$11.466

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Vyrian

USA . 8,926 parts In-Stock

1+ parts

-

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8,926

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Sensible Micro Corp

USA . 499 parts In-Stock

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499

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Semtec, LLC

USA . 14 parts In-Stock

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14

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Atlantic Semiconductor

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 236 parts In-Stock

1+ parts

$10.260

100+ parts

-

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236

$10.260

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Corphita

USA . 4,021 parts In-Stock

1+ parts

$10.863

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4,021

$10.863

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Parana Technologies

USA . 1,835 parts In-Stock

1+ parts

$29.430

100+ parts

-

1k+ parts

$59.247

10k+ parts

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1,835

$29.430

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$59.247

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DigiPath Technology Company

USA . 999 parts In-Stock

1+ parts

$32.406

100+ parts

$29.813

1k+ parts

-

10k+ parts

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999

$32.406

$29.813

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ChromeModa Solutions

Germany . 6,369 parts In-Stock

1+ parts

$33.067

100+ parts

$27.115

1k+ parts

-

10k+ parts

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6,369

$33.067

$27.115

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IDEA Electronic Components Group

UK . 588 parts In-Stock

1+ parts

$33.067

100+ parts

$31.414

1k+ parts

$29.760

10k+ parts

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588

$33.067

$31.414

$29.760

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Corohmni

South Africa . 3,221 parts In-Stock

1+ parts

$72.791

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3,221

$72.791

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Lixinc

USA . 9,782 parts In-Stock

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9,782

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Kepictronics

USA . 600 parts In-Stock

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Authorized Procurement Solutions

USA . 14 parts In-Stock

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14

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Overview

Experience unparalleled performance and efficiency with the TMS320C6726BRFP266 by Texas Instruments, a top-tier manufacturer in the industry. This Digital Signal Processor (DSP) offers cutting-edge technology and integrated cache for seamless operation. Ideal for applications requiring high-speed processing, this product delivers exceptional value and benefits to customers looking to elevate their projects. Trust in the quality and reliability of Texas Instruments while unlocking endless possibilities with the TMS320C6726BRFP266.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability while keeping the overall weight of the product low.

Integrated Cache: YES

Improves processing speed by storing frequently used data for quick access.

Maximum Supply Voltage: 1.32 V

Allows for safe operation within specified voltage limits.

On Chip Data RAM Width: 8

Enhances data processing capabilities of the DSP.

Address Bus Width: 32

Enables efficient data transfer and memory access.

Bit Size: 32

Supports complex mathematical calculations and signal processing operations.

Power Supplies (V): 1.2,3.3

Provides flexibility in power options for different applications.

No. of Terminals: 144

Offers various connection points for interfacing with external components.

Maximum Operating Temperature: 90 °C

Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature: 0 °C

Can operate effectively in a wide range of temperature conditions.

Maximum Seated Height: 1.2 mm

Allows for compact and slim device designs.

Internal Bus Architecture: MULTIPLE

Supports efficient data flow within the processor for improved performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Offers versatility in connecting to different types of external devices.

Technology: CMOS

Provides low power consumption and high noise immunity for reliable operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6726BRFP266 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

16

No. of Terminals:

144

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320C6726BRFP266 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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