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TMS320C6474FGUN2

Texas Instruments

TMS320C6474FGUN2 by Texas Instruments

TMS320C6474FGUN2 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at 625 MHz. It features an address bus width of 14 bits and external data bus width of 32 bits. Ideal for applications requiring high-speed processing such as embedded systems and digital signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,501 parts In-Stock

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Digiode

USA . 725 parts In-Stock

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725

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Distributors (Availability)

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AZTECH Wire

Italy . 693 parts In-Stock

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$15.757

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One Stop Electronics

USA . 1,412 parts In-Stock

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$29.000

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Parana Technologies

USA . 1,851 parts In-Stock

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$69.874

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DigiPath Technology Company

USA . 334 parts In-Stock

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$76.940

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334

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

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$78.510

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$74.584

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$70.659

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2,252

$78.510

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ChromeModa Solutions

Germany . 1,180 parts In-Stock

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$78.510

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$64.378

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Component Stockers USA

USA . 209 parts In-Stock

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$99.990

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Microchip USA

USA . 2,634 parts In-Stock

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Corphita

USA . 875 parts In-Stock

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Overview

Unlock the power of innovation with the TMS320C6474FGUN2 by Texas Instruments. As a leader in microprocessors, Texas Instruments delivers cutting-edge technology that exceeds expectations. Designed for high performance and reliability, this processor is perfect for a wide range of applications. From embedded systems to digital signal processing, the TMS320C6474FGUN2 offers unmatched value, benefits, and advantages to customers. Experience seamless integration, efficient operation, and exceptional quality with Texas Instruments at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability, making this product suitable for various environments.

Integrated Cache: YES

The integrated cache improves the performance of the microprocessor by providing faster access to frequently used data, enhancing overall speed and efficiency.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage of 1.2V ensures energy efficiency and helps in reducing power consumption of the microprocessor.

Address Bus Width: 14

The larger address bus width of 14 allows for accessing a larger memory space, enabling the microprocessor to handle more complex tasks and data processing.

Package Shape: SQUARE

The square package shape provides efficient use of space and facilitates easier mounting and handling of the microprocessor in various applications.

Bit Size: 32

The 32-bit size allows the microprocessor to process data in larger chunks, improving overall performance and speed of data processing.

Power Supplies (V): 1.1,1.8

The availability of multiple power supply options of 1.1V and 1.8V provides flexibility in power management and allows the microprocessor to be used in different power environments.

No. of Terminals: 561

The high number of terminals enables the microprocessor to connect with various external devices and components, enhancing its versatility and compatibility.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage of 0.9V ensures energy efficiency and stable operation of the microprocessor even under low power conditions.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C allows the microprocessor to function effectively in elevated temperature environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the microprocessor can operate reliably in colder environments without performance degradation.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides enhanced solderability and connectivity, ensuring secure connections and reliability in various electronic applications.

RAM Words: 8192

The large number of RAM words allows the microprocessor to store and access a significant amount of data, enhancing its capability to handle complex calculations and processing tasks efficiently.

Technical Specifications

Microprocessors TMS320C6474FGUN2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

14

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

625 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B561

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

561

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA561,27X27,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Speed:

1200 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6474FGUN2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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