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TISP8290KC-00

Texas Instruments

TISP8290KC-00 by Texas Instruments

TISP8290KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It features 2 functions, operates b/w 0°C to 70°C, and has a flange mount package style. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,492 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,492

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Digiode

USA . 1,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,215

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 604 parts In-Stock

1+ parts

$7.073

100+ parts

-

1k+ parts

$7.605

10k+ parts

-

604

$7.073

-

$7.605

-

AZTECH Wire

Italy . 875 parts In-Stock

1+ parts

$7.528

100+ parts

-

1k+ parts

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10k+ parts

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875

$7.528

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-

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DigiPath Technology Company

USA . 1,690 parts In-Stock

1+ parts

$7.788

100+ parts

-

1k+ parts

-

10k+ parts

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1,690

$7.788

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-

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ChromeModa Solutions

Germany . 3,159 parts In-Stock

1+ parts

$7.947

100+ parts

$6.517

1k+ parts

-

10k+ parts

-

3,159

$7.947

$6.517

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IDEA Electronic Components Group

UK . 615 parts In-Stock

1+ parts

$7.947

100+ parts

-

1k+ parts

$7.152

10k+ parts

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615

$7.947

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$7.152

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One Stop Electronics

USA . 703 parts In-Stock

1+ parts

$360.000

100+ parts

-

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10k+ parts

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703

$360.000

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Corphita

USA . 3,903 parts In-Stock

1+ parts

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3,903

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Overview

Enhance the reliability of your telecom systems with the TISP8290KC-00 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality protection ICs for telecom applications. This surge protection circuit offers peace of mind, safeguarding your equipment from voltage spikes and ensuring uninterrupted communication. With a durable plastic/epoxy package and convenient flange mount style, this product is designed for easy installation and long-term performance. Invest in the TISP8290KC-00 to protect your telecom investments and keep your business connected.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product reliable for long-term use in various conditions.

No. of Functions : 2

Having 2 functions in a single IC allows for multiple types of protection within one component, reducing the need for additional components and simplifying the design of the overall system.

Package Shape : RECTANGULAR

The rectangular shape provides easy integration into existing circuit layouts, optimizing space efficiency and ensuring compatibility with standard mounting configurations.

No. of Terminals : 3

With 3 terminals, this IC offers flexibility in connection options, allowing for versatile system design and compatibility with different types of circuit configurations.

Package Style (Meter) : FLANGE MOUNT

The flange mount style simplifies installation and ensures secure mounting, reducing the risk of displacement or damage, making it ideal for telecom applications where stability is crucial.

Maximum Operating Temperature : 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in demanding conditions, increasing the product's longevity and suitability for various environments.

Minimum Operating Temperature : 0 °C

The low minimum operating temperature of 0°C allows for operation in cold environments without compromising performance, making this product versatile and adaptable to different temperature ranges.

Terminal Position : SINGLE

The single terminal position simplifies installation and connection, reducing complexity and potential points of failure, enhancing the overall reliability of the system.

Temperature Grade : COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating conditions, making this product suitable for a wide range of commercial applications in the telecom industry.

Terminal Form : THROUGH-HOLE

The through-hole terminal form enables secure soldered connections, enhancing reliability and stability in the circuit, making it a preferred choice for telecom applications where robust connections are essential.

Telecom IC Type : SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this IC helps safeguard sensitive telecom equipment from voltage spikes and transient surges, ensuring uninterrupted operation and protecting the system from potential damage.

Technical Specifications

Telecom - Protection ICs TISP8290KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T3

No. of Functions:

2

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP8290KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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