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TISP3290KC-00

Texas Instruments

TISP3290KC-00 by Texas Instruments

TISP3290KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It features 2 functions, operates b/w 0°C to 70°C, and has a flange mount package style. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,148 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,148

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Digiode

USA . 2,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$9.495

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$9.495

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-

-

Parana Technologies

USA . 370 parts In-Stock

1+ parts

$11.303

100+ parts

-

1k+ parts

$11.735

10k+ parts

-

370

$11.303

-

$11.735

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DigiPath Technology Company

USA . 2,000 parts In-Stock

1+ parts

$12.446

100+ parts

$11.450

1k+ parts

-

10k+ parts

-

2,000

$12.446

$11.450

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ChromeModa Solutions

Germany . 5,319 parts In-Stock

1+ parts

$12.700

100+ parts

$10.414

1k+ parts

-

10k+ parts

-

5,319

$12.700

$10.414

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IDEA Electronic Components Group

UK . 1,190 parts In-Stock

1+ parts

$12.700

100+ parts

$12.065

1k+ parts

$11.430

10k+ parts

-

1,190

$12.700

$12.065

$11.430

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One Stop Electronics

USA . 1,147 parts In-Stock

1+ parts

$765.000

100+ parts

-

1k+ parts

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10k+ parts

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1,147

$765.000

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Corphita

USA . 4,331 parts In-Stock

1+ parts

-

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10k+ parts

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4,331

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Overview

Secure your telecom equipment with the TISP3290KC-00 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This surge protection circuit offers peace of mind and ensures the longevity of your valuable telecom devices. With its easy installation and durable construction, the TISP3290KC-00 is a must-have for anyone looking to protect their equipment from power surges. Trust Texas Instruments to provide the best protection for your telecom applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

No. of Functions: 2

Having 2 functions allows for more comprehensive protection for telecom equipment, enhancing overall system reliability.

Package Shape: RECTANGULAR

Rectangular shape makes it easier for integration into existing systems and PCB layouts.

No. of Terminals: 3

3 terminals provide secure connections for efficient signal transmission and protection.

Package Style (Meter): FLANGE MOUNT

Flange mount style simplifies installation and maintenance of the IC in telecom applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can withstand high temperature environments common in telecom applications.

Minimum Operating Temperature: 0 °C

The ability to operate at 0 °C ensures functionality even in colder environments, providing reliable protection year-round.

Terminal Position: SINGLE

Single terminal position simplifies installation and reduces potential errors in connection.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in the telecom industry.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and stable connections, ideal for telecom applications with high vibration levels.

Telecom IC Type: SURGE PROTECTION CIRCUIT

This type of IC provides essential surge protection for telecom equipment, safeguarding against voltage spikes and ensuring reliable performance.

Technical Specifications

Telecom - Protection ICs TISP3290KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T3

No. of Functions:

2

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP3290KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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