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TISP1082KC-00

Texas Instruments

TISP1082KC-00 by Texas Instruments

TISP1082KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It features 2 functions, operates b/w 0°C to 70°C, and has a flange mount package style. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,037 parts In-Stock

1+ parts

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8,037

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Digiode

USA . 3,800 parts In-Stock

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3,800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,765 parts In-Stock

1+ parts

$12.902

100+ parts

-

1k+ parts

$13.388

10k+ parts

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1,765

$12.902

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$13.388

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

$14.207

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2,004

$14.207

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ChromeModa Solutions

Germany . 1,758 parts In-Stock

1+ parts

$14.497

100+ parts

$11.888

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1,758

$14.497

$11.888

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IDEA Electronic Components Group

UK . 608 parts In-Stock

1+ parts

$14.497

100+ parts

$13.772

1k+ parts

$13.047

10k+ parts

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608

$14.497

$13.772

$13.047

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AZTECH Wire

Italy . 835 parts In-Stock

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$16.248

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835

$16.248

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Semicontronic

India . 1,484 parts In-Stock

1+ parts

$280.000

100+ parts

$273.000

1k+ parts

$271.600

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1,484

$280.000

$273.000

$271.600

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One Stop Electronics

USA . 1,571 parts In-Stock

1+ parts

$534.000

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1,571

$534.000

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Corphita

USA . 4,947 parts In-Stock

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4,947

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Corohmni

South Africa . 206 parts In-Stock

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206

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Overview

Upgrade your telecom systems with the TISP1082KC-00 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This surge protection circuit offers unmatched protection for your telecommunications equipment, ensuring optimal performance and longevity. With a durable plastic/epoxy package body and flange mount style, this IC is designed for easy installation and maximum efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets the demands of the telecom industry, providing peace of mind and superior protection for your valuable equipment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides good insulation and protection to the internal components of the IC, making it durable and reliable for long-term use.

No. of Functions: 2

Having 2 functions in one IC allows for more comprehensive protection against different types of telecom system threats, providing added security to the overall system.

Package Shape: RECTANGULAR

Rectangular package shape makes it easier to mount and integrate the IC into existing telecom system designs, saving space and making installation more convenient.

No. of Terminals: 3

3 terminals allow for easy connection and setup, reducing installation time and effort, and ensuring proper functioning of the protection IC in the system.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure attachment to the telecom system, preventing accidental disconnection or damage, and ensuring the protection IC stays in place during operation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this protection IC can withstand higher temperatures without compromising its performance, making it suitable for a wide range of operating conditions.

Minimum Operating Temperature: 0 °C

Being able to operate effectively at temperatures as low as 0°C ensures that the protection IC can function reliably in colder environments, making it versatile and adaptable for different settings.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and reduces the chances of wiring errors, ensuring the protection IC is correctly connected and aligned for optimal performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade means this protection IC is suitable for standard commercial telecom applications, providing cost-effective protection solutions for various systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers easy soldering and interconnection with other components, facilitating the assembly process and ensuring secure and stable connections for reliable performance.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Designed specifically for surge protection in telecom systems, this IC offers specialized functionality to safeguard against voltage spikes and transient overloads, enhancing the overall reliability and longevity of the system.

Technical Specifications

Telecom - Protection ICs TISP1082KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T3

No. of Functions:

2

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP1082KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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