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TISP4290KC-00

Texas Instruments

TISP4290KC-00 by Texas Instruments

TISP4290KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It operates b/w 0°C to 70°C, with a flange mount style package and through-hole terminals. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,610

-

-

-

-

Digiode

USA . 3,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,307

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 674 parts In-Stock

1+ parts

$8.896

100+ parts

$826.087

1k+ parts

$8.006

10k+ parts

-

674

$8.896

$826.087

$8.006

-

AZTECH Wire

Italy . 650 parts In-Stock

1+ parts

$9.129

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$9.129

-

-

-

DigiPath Technology Company

USA . 2,370 parts In-Stock

1+ parts

$9.795

100+ parts

$9.011

1k+ parts

-

10k+ parts

-

2,370

$9.795

$9.011

-

-

ChromeModa Solutions

Germany . 3,943 parts In-Stock

1+ parts

$9.995

100+ parts

$8.196

1k+ parts

-

10k+ parts

-

3,943

$9.995

$8.196

-

-

IDEA Electronic Components Group

UK . 2,245 parts In-Stock

1+ parts

$9.995

100+ parts

$9.495

1k+ parts

$8.996

10k+ parts

-

2,245

$9.995

$9.495

$8.996

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One Stop Electronics

USA . 519 parts In-Stock

1+ parts

$431.000

100+ parts

-

1k+ parts

-

10k+ parts

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519

$431.000

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-

-

Corphita

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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470

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Overview

Upgrade your telecom equipment with the TISP4290KC-00 surge protection circuit from Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a solution that ensures the safety and longevity of your devices. This protection IC is perfect for safeguarding your telecom systems from power surges, providing peace of mind and uninterrupted communication. Trust in Texas Instruments to deliver the protection your equipment deserves.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection against environmental factors such as moisture, dust, and temperature changes, ensuring the longevity and reliability of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and compact PCB layout, saving space and making installation easier in telecommunication devices.

No. of Terminals: 2

Having only two terminals simplifies the installation process, reducing the chances of error and making the product user-friendly.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables secure attachment to a surface, providing stability and durability in rugged telecom environments.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand extreme conditions without compromising performance or safety.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in colder environments, making it versatile for various deployment scenarios.

Terminal Position: SINGLE

Single terminal position streamlines the connection process, reducing complexity and potential points of failure in the system.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in telecom applications, offering reliable performance in typical environments.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and easy soldering during assembly, enhancing the product's overall reliability and durability.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this product safeguards connected devices from voltage spikes and surges, ensuring the integrity and longevity of telecommunication equipment.

Technical Specifications

Telecom - Protection ICs TISP4290KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T2

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP4290KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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