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TISP61089ASDR

Texas Instruments

TISP61089ASDR by Texas Instruments

TISP61089ASDR by Texas Instruments is a Telecom Surge Protection IC with 8 terminals, operating temperature range of -40 to 85°C. Its small outline package style and gull wing terminal form make it suitable for telecom applications requiring surge protection in industrial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Edge Electronics

USA . 1,350 parts In-Stock

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1,350

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Distributors (In-Stock)

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Elcom Components

USA . 2,060 parts In-Stock

1+ parts

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2,060

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Digiode

USA . 1,393 parts In-Stock

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1,393

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Vyrian

USA . 1,052 parts In-Stock

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1,052

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,446 parts In-Stock

1+ parts

$8.433

100+ parts

-

1k+ parts

$9.073

10k+ parts

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1,446

$8.433

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$9.073

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DigiPath Technology Company

USA . 690 parts In-Stock

1+ parts

$9.286

100+ parts

$8.543

1k+ parts

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690

$9.286

$8.543

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ChromeModa Solutions

Germany . 2,887 parts In-Stock

1+ parts

$9.475

100+ parts

$7.770

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2,887

$9.475

$7.770

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IDEA Electronic Components Group

UK . 106 parts In-Stock

1+ parts

$9.475

100+ parts

$9.001

1k+ parts

$8.528

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106

$9.475

$9.001

$8.528

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Corphita

USA . 1,664 parts In-Stock

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1,664

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Overview

Experience superior protection for your telecom applications with the TISP61089ASDR by Texas Instruments. Crafted with precision using high-quality materials, this surge protection circuit offers unmatched reliability and durability. Designed for industrial-grade performance, this small outline package includes gull wing terminals for easy installation. Safeguard your telecom systems from voltage surges and ensure uninterrupted communication with the TISP61089ASDR. Trust Texas Instruments for cutting-edge technology that delivers peace of mind and unparalleled value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the protection IC, making it suitable for various telecom applications.

Surface Mount: YES

Being surface mountable simplifies the installation process, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs, making it ideal for compact telecom devices.

No. of Terminals: 8

Having 8 terminals provides versatility in connecting the protection IC within the telecom system, accommodating various configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even in challenging environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the protection IC to function effectively in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connectivity options, enhancing adaptability in telecom setups.

Maximum Seated Height: 1.75 mm

The low seated height enables a sleek and compact design for the protection IC, saving space in telecom devices.

Width: 3.9 mm

The narrow width facilitates the integration of the protection IC in space-constrained telecom equipment.

Length: 4.9 mm

The short length of the IC contributes to a compact footprint on the PCB, ideal for handheld or small telecom devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the protection IC can withstand harsh operating conditions commonly found in telecom environments.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process during assembly, enhancing the reliability of the protection IC in telecom applications.

Telecom IC Type: SURGE PROTECTION CIRCUIT

The surge protection circuit functionality helps safeguard telecom equipment from electrical surges, ensuring a reliable and stable operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting of the protection IC on the PCB, increasing efficiency in telecom system design.

Technical Specifications

Telecom - Protection ICs TISP61089ASDR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61089ASDR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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