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TISPPBL1DR

Texas Instruments

TISPPBL1DR by Texas Instruments

TISPPBL1DR by Texas Instruments is a Telecom Surge Protection IC with 8 terminals, operating temperature range of -40 to 85°C. Its small outline package style and gull wing terminal form make it suitable for telecom applications requiring protection against surges.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,329 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5,000 parts In-Stock

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Digiode

USA . 4,961 parts In-Stock

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4,961

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Cyclops Electronics Ltd

UK . 2,180 parts In-Stock

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AZTECH Wire

Italy . 855 parts In-Stock

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$8.206

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855

$8.206

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Parana Technologies

USA . 1,155 parts In-Stock

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$13.385

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$13.903

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1,155

$13.385

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$13.903

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ChromeModa Solutions

Germany . 3,082 parts In-Stock

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$15.039

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$12.332

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3,082

$15.039

$12.332

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IDEA Electronic Components Group

UK . 277 parts In-Stock

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$15.039

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$14.287

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$13.535

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277

$15.039

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$13.535

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One Stop Electronics

USA . 496 parts In-Stock

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$964.000

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A-Z Elektronik GmbH

Germany . 4,740 parts In-Stock

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Kepictronics

USA . 1,317 parts In-Stock

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DigiPath Technology Company

USA . 1,142 parts In-Stock

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$13.559

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Corphita

USA . 1,104 parts In-Stock

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GreenTree Electronics

Israel . 59 parts In-Stock

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Overview

Upgrade your telecom systems with the TISPPBL1DR surge protection circuit by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for telecom protection ICs. This small outline package offers advanced protection in a compact design, ensuring your equipment stays safe from power surges. Trust in Texas Instruments to provide the highest level of performance and durability. Elevate your telecom systems with the TISPPBL1DR and experience unparalleled peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring reliable performance in varied operating conditions.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 8

Offers flexibility in connectivity options, accommodating various circuit configurations.

Package Style: SMALL OUTLINE

Facilitates compact integration into electronic devices, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures the IC can operate effectively in high-temperature environments, enhancing its reliability and performance.

Minimum Operating Temperature: -40 °C

Allows for operation in cold temperature conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Enables multiple connection points, enhancing versatility and compatibility with different circuit layouts.

Maximum Seated Height: 1.75 mm

Low profile design helps in space-constrained applications, making it easier to fit into compact electronic devices.

Width: 3.9 mm

Compact width makes it suitable for compact circuit board layouts, maximizing space efficiency.

Length: 4.9 mm

Optimal length for fitting into various electronic devices, ensuring compatibility and ease of integration.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliable performance in harsh operating conditions.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections, reducing the risk of disconnection or damage during operation.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Designed specifically for protecting telecom equipment from voltage surges, ensuring the safety and longevity of connected devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into circuit boards, facilitating compatibility with existing designs.

Technical Specifications

Telecom - Protection ICs TISPPBL1DR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISPPBL1DR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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