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TISP2180KC-00

Texas Instruments

TISP2180KC-00 by Texas Instruments

TISP2180KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It features 2 functions, operates b/w 0°C to 70°C, and has a flange mount package style. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,101 parts In-Stock

1+ parts

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1k+ parts

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6,101

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Digiode

USA . 1,794 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,794

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,364 parts In-Stock

1+ parts

$13.589

100+ parts

-

1k+ parts

$14.092

10k+ parts

-

1,364

$13.589

-

$14.092

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ChromeModa Solutions

Germany . 2,812 parts In-Stock

1+ parts

$15.269

100+ parts

$12.521

1k+ parts

-

10k+ parts

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2,812

$15.269

$12.521

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IDEA Electronic Components Group

UK . 1,915 parts In-Stock

1+ parts

$15.269

100+ parts

$14.506

1k+ parts

$13.742

10k+ parts

-

1,915

$15.269

$14.506

$13.742

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AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$17.415

100+ parts

-

1k+ parts

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257

$17.415

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One Stop Electronics

USA . 833 parts In-Stock

1+ parts

$109.000

100+ parts

-

1k+ parts

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833

$109.000

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Corphita

USA . 535 parts In-Stock

1+ parts

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535

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DigiPath Technology Company

USA . 87 parts In-Stock

1+ parts

-

100+ parts

$13.767

1k+ parts

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87

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$13.767

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Overview

Power up your telecom equipment with the TISP2180KC-00 surge protection circuit by Texas Instruments. Designed with quality and reliability in mind, this protection IC offers peace of mind for your valuable devices. Whether you're protecting a home phone line or a large-scale network, this product ensures your equipment stays safe from power surges. Trust in Texas Instruments for top-of-the-line telecom protection solutions that deliver unmatched performance and value. Choose the TISP2180KC-00 for superior protection that won't let you down.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is durable and can withstand the rigors of telecom environments, making this product reliable for long-term use.

No. of Functions: 2

Having 2 functions in a single IC allows for more comprehensive protection against various types of surges and faults, enhancing the overall reliability of the telecom infrastructure.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on PCBs, saving space and enabling compact designs for telecom equipment.

No. of Terminals: 3

With 3 terminals, this IC can easily connect to other components in the circuit, ensuring seamless integration within the telecom system.

Package Style (Meter): FLANGE MOUNT

Flange mount package style enables easy installation and maintenance of the IC in telecom equipment, reducing downtime and operational disruptions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the IC to function reliably even in elevated temperature conditions, making it suitable for telecom environments where heat dissipation can be a concern.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures that the IC can perform effectively in cold environments, providing year-round protection for telecom systems.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and assembly, making it easier for manufacturers to incorporate this IC into their telecom products.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that this IC meets industry standards for performance and reliability, making it a trusted choice for telecom applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers secure connections and robust mechanical support, preventing disconnections or damage during operation in telecom equipment.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this IC plays a crucial role in safeguarding telecom equipment from voltage spikes and surges, ensuring uninterrupted service and extended product lifespan.

Technical Specifications

Telecom - Protection ICs TISP2180KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T3

No. of Functions:

2

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP2180KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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