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TISP61089AD

Texas Instruments

TISP61089AD by Texas Instruments

TISP61089AD by Texas Instruments is a Telecom IC for surge protection circuits. It features 8 terminals, GULL WING form, and operates b/w -40 to 85°C. Ideal for telecom applications requiring surface mount protection in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Bristol Electronics

USA . 15,000 parts In-Stock

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Vyrian

USA . 3,123 parts In-Stock

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Digiode

USA . 2,606 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 548 parts In-Stock

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548

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Prism Electronics

USA . 86 parts In-Stock

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86

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LWI Electronics Inc

India . 17 parts In-Stock

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Parana Technologies

USA . 1,919 parts In-Stock

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$8.776

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$9.462

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1,919

$8.776

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$9.462

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$8.900

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$8.811

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$8.455

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100

$8.900

$8.811

$8.455

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DigiPath Technology Company

USA . 744 parts In-Stock

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$9.664

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744

$9.664

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ChromeModa Solutions

Germany . 4,332 parts In-Stock

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$9.861

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$8.086

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$9.861

$8.086

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IDEA Electronic Components Group

UK . 1,227 parts In-Stock

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$9.861

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$9.368

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$8.875

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$8.875

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AZTECH Wire

Italy . 718 parts In-Stock

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$19.014

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$19.014

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One Stop Electronics

USA . 1,395 parts In-Stock

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$949.000

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RC Electronics

USA . 17,100 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 5,460 parts In-Stock

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Corphita

USA . 4,223 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Benley Electronics

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 96 parts In-Stock

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Overview

Enhance the reliability of your telecom systems with the TISP61089AD by Texas Instruments, a top-tier manufacturer known for quality and innovation. This surge protection circuit provides unparalleled protection against voltage spikes, ensuring the longevity and performance of your equipment. Ideal for telecom applications, this small outline package offers dual terminals and industrial-grade temperature tolerance, making it a valuable investment for your systems. Experience peace of mind knowing that your telecom devices are safeguarded with the TISP61089AD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC material provides durability and reliability to the product, while EPOXY offers resistance to moisture and chemicals, making it suitable for various environments.

Surface Mount: YES

Being surface mountable, this product can be easily assembled on circuit boards, saving space and improving overall product design.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on PCBs, optimizing space usage and enabling easier integration into existing systems.

No. of Terminals: 8

With 8 terminals, this product offers flexibility in connectivity options, allowing for versatile applications in telecom equipment.

Package Style (Meter): SMALL OUTLINE

Small outline package style enables compactness and minimizes footprint, ideal for space-constrained telecom devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability under demanding conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments, enhancing the product's versatility.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved connectivity, ensuring a secure connection for critical telecom functions.

Maximum Seated Height: 1.75 mm

Low maximum seated height enables a compact design, reducing the overall profile of the product and improving space utilization.

Width: 3.9 mm

Narrow width enhances the product's compatibility with various system layouts and ensures efficient use of space on the PCB.

Length: 4.9 mm

Compact length makes the product suitable for applications where space is limited, offering ease of integration in telecom devices.

Temperature Grade: INDUSTRIAL

Industrial grade temperature tolerance ensures the product's reliability in harsh operating conditions, meeting the requirements of telecom industry standards.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure solder connections, enhancing the product's durability and longevity.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry safeguards telecom equipment from voltage spikes and transient surges, ensuring the longevity and operational integrity of devices.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density PCB layouts, improving connectivity and enabling the product to be used in space-constrained telecom applications.

Technical Specifications

Telecom - Protection ICs TISP61089AD attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61089AD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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