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TISP61089DR-S

Bourns

TISP61089DR-S by Bourns

Bourns TISP61089DR-S is a surge protection circuit for telecom applications. With 8 terminals, it offers industrial-grade protection with operating temperatures from -40 to 85°C. This rectangular, small outline package is surface-mountable and has a peak reflow temperature of 260°C.

Median Price

$0.778

Lifecycle Status

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Chip1Stop

Japan . 2,591 parts In-Stock

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$0.439

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$0.311

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Arrow

USA . 1,553 parts In-Stock

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$0.778

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$0.551

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$0.455

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Verical

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$1.155

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ComSIT Distribution GmbH

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Vyrian

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Bristol Electronics

USA . 4,877 parts In-Stock

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$0.531

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$0.368

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Dan-Mar Components

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Inventory MP

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EMSNET

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IBS Electronics

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Speed Components Ltd

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Ampacity Inc.

Singapore . 1,402 parts In-Stock

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Perfect Parts

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S.R.D Solutions

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iodParts Technologies Inc.

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Netroflash

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Overview

Safeguard your telecom devices with the TISP61089DR-S surge protection circuit from Bourns. With a reputation for excellence in protection ICs, Bourns delivers top-quality products that ensure the longevity and reliability of your equipment. This small outline package offers dual terminals and a matte tin finish, making it easy to integrate into your systems. Trust Bourns to provide industrial-grade protection against surges, with a wide operating temperature range from -40 to 85°C. Ensure peace of mind for your telecom applications with the TISP61089DR-S by Bourns.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the IC, ensuring reliable performance in various operating conditions.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving time and space in the overall system design.

Package Shape: RECTANGULAR

The rectangular package shape is standard and fits well with common board layouts, making integration into existing designs straightforward.

No. of Terminals: 8

With 8 terminals, this IC offers versatile connectivity options for different circuit configurations and connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the board, allowing for compact and efficient circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in cold environments, making this IC suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability, ensuring secure connections and long-term reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit connectivity and allows for easy integration into different circuit layouts.

Maximum Seated Height: 1.75 mm

The low maximum seated height helps to minimize the overall profile of the IC, making it suitable for space-constrained applications.

Width: 3.9 mm

The narrow width of the IC enables compact placement on the circuit board, saving space and facilitating efficient board layout.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures safe and reliable soldering processes during installation, minimizing the risk of damage to the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for robust soldering processes, ensuring secure connections and long-term reliability of the IC.

Length: 4.9 mm

The compact length of the IC helps to optimize board space utilization and supports the design of compact and efficient circuit layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding operating conditions, making this IC suitable for a wide range of industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy integration into circuit designs, ensuring stable performance and long-term reliability.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC helps to safeguard telecom systems and equipment from voltage spikes and surges, ensuring reliable operation and protection against damage.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact layout design and easy connection to other components, supporting efficient and reliable circuit integration.

Technical Specifications

Telecom - Protection ICs TISP61089DR-S attributes and parameters. Explore more Telecom - Protection ICs devices from Bourns

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TISP61089DR-S Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Bourns

Bourns, Inc. is an American electronics company that develops, manufactures and supplies electronic components for a variety of industries including automotive, industrial, instrumentation, medical electronics, consumer equipment and portable electronics. Established in Altadena, California in 1947 by Marlan and Rosemary Bourns, graduates of the University of Michigan, the company was founded to develop and sell electronic components and sensors to the aerospace industry. Bourns has 15 manufacturing facilities around the world and has continued growing through the development of new products and technologies as well as through acquisitions. The company has approximately 9000 employees worldwide.

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