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L3100B1

STMicroelectronics

L3100B1 by STMicroelectronics

L3100B1 by STMicroelectronics is a surge protection circuit for telecom applications. It features an 8-terminal rectangular package with TIN LEAD finish and 2.54mm terminal pitch. With a compact size of 7.62mm width and 4.8mm seated height, it offers reliable protection in telecom systems.

Median Price

$8.736

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 33 parts In-Stock

1+ parts

$8.736

100+ parts

$4.077

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33

$8.736

$4.077

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Digiode

USA . 3,485 parts In-Stock

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Vyrian

USA . 3,343 parts In-Stock

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3,343

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Anansix

USA . 2,348 parts In-Stock

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2,348

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J2 Sourcing AB

Sweden . 170 parts In-Stock

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170

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Ack Elektronik San.Tic.Ltd.Sti

. 129 parts In-Stock

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129

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Goldney Electronics S.L.

Spain . 113 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 89 parts In-Stock

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Extreme Components

USA . 50 parts In-Stock

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Halfin

Belgium . 40 parts In-Stock

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40

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Lakeland Logistics Inc

USA . 33 parts In-Stock

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33

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Resion

USA . 20 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,509 parts In-Stock

1+ parts

$5.858

100+ parts

-

1k+ parts

$5.272

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1,509

$5.858

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$5.272

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MKK Technologies

India . 1,955 parts In-Stock

1+ parts

$11.015

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1,955

$11.015

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DigiPath Technology Company

USA . 1,955 parts In-Stock

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$11.015

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1,955

$11.015

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Corphita

USA . 2,749 parts In-Stock

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2,749

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Parana Technologies

USA . 1,503 parts In-Stock

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$7.004

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1,503

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$7.004

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Kepictronics

USA . 550 parts In-Stock

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550

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Assy Fe

Spain . 492 parts In-Stock

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492

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Overview

Enhance the reliability of your telecom systems with the L3100B1 surge protection circuit from STMicroelectronics. Manufactured with high-quality materials and precision engineering, this product offers superior protection for your telecommunications equipment. With its compact design and easy installation, the L3100B1 provides peace of mind against power surges, ensuring uninterrupted communication and minimizing downtime. Trust in STMicroelectronics to deliver cutting-edge solutions for your telecom protection needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, making it suitable for telecom applications where reliability is crucial.

No. of Terminals: 8

Having 8 terminals allows for more connections and flexibility in circuit design, making this IC versatile for different applications within the telecom industry.

Maximum Seated Height: 4.8 mm

With a compact maximum seated height, this IC can be easily integrated into space-constrained telecom equipment without causing interference or obstruction.

Terminal Position: DUAL

Dual terminal positions provide redundancy and ensure reliable connections, reducing the risk of signal loss or failure in telecom systems.

Telecom IC Type: SURGE PROTECTION CIRCUIT

The surge protection circuit in this IC helps safeguard telecom equipment from voltage spikes and transient surges, enhancing the overall reliability and longevity of the system.

Technical Specifications

Telecom - Protection ICs L3100B1 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.8 mm

Surface Mount:

NO

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

L3100B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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