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L3100B

STMicroelectronics

L3100B by STMicroelectronics

L3100B by STMicroelectronics is a surge protection circuit for telecom applications. It features 8 terminals in an in-line package with dimensions of 7.62mm width and 4.8mm max seated height. The terminal pitch is 2.54mm, making it suitable for telecom equipment requiring robust protection against surges.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Fibra_Brandt Electronic GMBH

Germany . 6,400 parts In-Stock

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6,400

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Vyrian

USA . 2,545 parts In-Stock

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2,545

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Anansix

USA . 1,274 parts In-Stock

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1,274

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Digiode

USA . 1,146 parts In-Stock

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1,146

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Corel Iberica Componentes, S.L.

Spain . 159 parts In-Stock

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159

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ECAB

Sweden . 138 parts In-Stock

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138

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Digital Electronic Gebert Verwaltungs UG

Germany . 26 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 206 parts In-Stock

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$8.918

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$8.027

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206

$8.918

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$8.027

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MKK Technologies

India . 2,369 parts In-Stock

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$16.771

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2,369

$16.771

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DigiPath Technology Company

USA . 2,369 parts In-Stock

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$16.771

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2,369

$16.771

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Infinite Electronics LLP (Excess)

. 10,005 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,378 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,252 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,599 parts In-Stock

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Kepictronics

USA . 2,150 parts In-Stock

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Assy Fe

Spain . 1,996 parts In-Stock

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Perfect Parts

USA . 1,814 parts In-Stock

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1,814

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Parana Technologies

USA . 964 parts In-Stock

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$10.663

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964

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$10.663

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Cyclops Electronics Ltd (Excess)

UK . 810 parts In-Stock

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810

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Overview

The L3100B by STMicroelectronics is a game-changer in the world of Telecom Protection ICs. With its superior quality and innovative design, this product offers unmatched protection for your telecom systems. Designed with precision and reliability in mind, this surge protection circuit provides peace of mind and ensures the longevity of your equipment. Whether you're looking to safeguard your network from power surges or lightning strikes, the L3100B has got you covered. Trust STMicroelectronics to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

This shape is commonly used for IC packages, making it easy to integrate into existing circuit designs.

No. of Terminals: 8

Having 8 terminals allows for more connections and flexibility in the circuit design, accommodating various configurations.

Package Style (Meter): IN-LINE

The in-line package style is compact and space-saving, suitable for applications where size constraints are a concern.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability, ensuring reliable connections in the circuit.

Terminal Position: DUAL

Dual terminal position allows for multiple points of contact, improving the overall stability and performance of the IC.

Maximum Seated Height: 4.8 mm

With a low seated height, this IC can be easily mounted in compact spaces without obstructing nearby components.

Width: 7.62 mm

The narrow width of this IC makes it suitable for applications where space is limited, offering more flexibility in circuit board layout.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mechanical connections, making it easier to assemble and solder the IC onto the PCB.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC helps safeguard telecom equipment from voltage spikes and transient events, ensuring reliable operation.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy integration into various PCB designs and sockets, making it versatile and compatible.

Technical Specifications

Telecom - Protection ICs L3100B attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.8 mm

Surface Mount:

NO

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

L3100B Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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