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TISP61089ADR

Texas Instruments

TISP61089ADR by Texas Instruments

TISP61089ADR by Texas Instruments is a Telecom Surge Protection IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, ideal for industrial applications. With gull wing terminals and surface mount capability, it offers reliable protection in compact dimensions.

Median Price

$0.800

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 720 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

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720

$0.800

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DF Sales Co.

USA . 720 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

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720

$0.800

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-

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American Microsemiconductor Inc.

USA . 6,000 parts In-Stock

1+ parts

$1.140

100+ parts

-

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6,000

$1.140

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-

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Bristol Electronics

USA . 15,000 parts In-Stock

1+ parts

-

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15,000

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 7,500 parts In-Stock

1+ parts

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7,500

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ComSIT Distribution GmbH

Germany . 6,780 parts In-Stock

1+ parts

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6,780

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ComSIT USA

USA . 6,780 parts In-Stock

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6,780

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Vyrian

USA . 4,482 parts In-Stock

1+ parts

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4,482

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ACDS - Activité Composants Distribution Service

France . 1,564 parts In-Stock

1+ parts

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1,564

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Dan-Mar Components

USA . 1,564 parts In-Stock

1+ parts

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1,564

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Digiode

USA . 771 parts In-Stock

1+ parts

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771

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LWI Electronics Inc

India . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$7.157

100+ parts

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514

$7.157

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Parana Technologies

USA . 1,241 parts In-Stock

1+ parts

$12.561

100+ parts

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1k+ parts

$13.014

10k+ parts

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1,241

$12.561

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$13.014

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DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$13.831

100+ parts

$12.724

1k+ parts

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10k+ parts

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694

$13.831

$12.724

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ChromeModa Solutions

Germany . 1,785 parts In-Stock

1+ parts

$14.113

100+ parts

$11.573

1k+ parts

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1,785

$14.113

$11.573

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

1+ parts

$14.113

100+ parts

$13.407

1k+ parts

$12.702

10k+ parts

-

1,295

$14.113

$13.407

$12.702

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Component Stockers USA

USA . 732 parts In-Stock

1+ parts

$99.990

100+ parts

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732

$99.990

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One Stop Electronics

USA . 1,629 parts In-Stock

1+ parts

$883.000

100+ parts

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1,629

$883.000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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A-Z Elektronik GmbH

Germany . 6,452 parts In-Stock

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6,452

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Assy Fe

Spain . 2,458 parts In-Stock

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2,458

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Corphita

USA . 2,378 parts In-Stock

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2,378

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Kepictronics

USA . 2,162 parts In-Stock

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2,162

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Perfect Parts

USA . 619 parts In-Stock

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619

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GreenTree Electronics

Israel . 553 parts In-Stock

1+ parts

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1k+ parts

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553

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Overview

Enhance the reliability of your telecom systems with the TISP61089ADR by Texas Instruments. Renowned for their quality and innovation, Texas Instruments delivers protection ICs that ensure your equipment is safeguarded against surges and overvoltage events. Perfect for a wide range of telecom applications, this small outline package offers customers peace of mind with its industrial-grade temperature rating and dual terminal position. Trust in Texas Instruments to provide the protection your telecom system needs to operate efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, ensuring long-term performance and reliability in telecom applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB and easy placement within the overall telecom system design.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for versatile usage in different circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact telecom devices or systems with limited real estate.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures common in telecom environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions, making it suitable for diverse environments.

Terminal Position: DUAL

Dual terminal position offers redundancy in connections, enhancing the reliability and stability of the IC in telecom circuits.

Maximum Seated Height: 1.75 mm

Low seated height enables a compact profile for the IC, facilitating the design of slim and sleek telecom devices or equipment.

Width: 3.9 mm

Narrow width allows for efficient space utilization on the PCB, enabling dense packing of components in telecom systems without sacrificing performance.

Length: 4.9 mm

Compact length ensures a small footprint on the PCB, contributing to a space-saving design for telecom applications with limited board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robust performance and reliability in harsh operating conditions typically found in telecom infrastructure.

Terminal Form: GULL WING

Gull wing terminal form provides a strong and reliable connection to the PCB, ensuring stable operation and ease of installation in telecom circuits.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry helps safeguard telecom equipment from voltage spikes and transient events, enhancing the longevity and durability of the overall system.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this IC allows for high-density mounting on the PCB, enabling efficient use of space in telecom applications with tight layout constraints.

Technical Specifications

Telecom - Protection ICs TISP61089ADR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61089ADR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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