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TCM1030DR

Texas Instruments

TCM1030DR by Texas Instruments

Texas Instruments TCM1030DR is a Telecom IC for surge protection circuits. It features 8 terminals, GULL WING form, and operates b/w -40 to 85°C. Ideal for telecom applications requiring compact, surface-mountable protection ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,862 parts In-Stock

1+ parts

-

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3,862

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Vyrian

USA . 3,357 parts In-Stock

1+ parts

-

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3,357

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Electronics Depot

USA . 186 parts In-Stock

1+ parts

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186

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 647 parts In-Stock

1+ parts

$11.232

100+ parts

-

1k+ parts

$11.667

10k+ parts

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647

$11.232

-

$11.667

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DigiPath Technology Company

USA . 1,011 parts In-Stock

1+ parts

$12.368

100+ parts

-

1k+ parts

-

10k+ parts

-

1,011

$12.368

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ChromeModa Solutions

Germany . 4,895 parts In-Stock

1+ parts

$12.620

100+ parts

$10.348

1k+ parts

-

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4,895

$12.620

$10.348

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IDEA Electronic Components Group

UK . 1,682 parts In-Stock

1+ parts

$12.620

100+ parts

$11.989

1k+ parts

$11.358

10k+ parts

-

1,682

$12.620

$11.989

$11.358

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AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$16.851

100+ parts

-

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391

$16.851

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One Stop Electronics

USA . 1,023 parts In-Stock

1+ parts

$799.000

100+ parts

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1,023

$799.000

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Corphita

USA . 474 parts In-Stock

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474

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Overview

Enhance your telecom systems with the TCM1030DR surge protection circuit by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for telecom applications. This protection IC offers peace of mind by safeguarding your equipment from voltage spikes and surges. With its compact design and industrial temperature grade, the TCM1030DR is a valuable addition to any telecom setup. Trust Texas Instruments for superior performance and protect your investments with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection against external elements, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape fits well with standard PCB layouts and allows for efficient use of space.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the protection circuit within the telecom system.

Package Style (Meter): SMALL OUTLINE

Small outline package style is compact and ideal for space-constrained telecom applications.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the protection circuit to function even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connection options.

Maximum Seated Height: 1.75 mm

Low seated height saves space and enables a compact design.

Width: 3.9 mm

Narrow width allows for efficient placement on the PCB and saves space.

Length: 4.9 mm

Compact length enables a smaller footprint on the PCB, optimizing space usage.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature handling ensures reliable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure connection to the PCB.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Designed specifically for surge protection in telecom systems, ensuring reliable operation and protection.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting on the PCB, saving space and enabling efficient design layouts.

Technical Specifications

Telecom - Protection ICs TCM1030DR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TCM1030DR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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