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TISP61089BD

Texas Instruments

TISP61089BD by Texas Instruments

TISP61089BD by Texas Instruments is a Telecom surge protection IC with 8 terminals, GULL WING form, and PLASTIC/EPOXY body. It operates b/w -40 to 85 °C, ideal for industrial applications requiring compact SMALL OUTLINE package style. Suitable for surface mount designs in telecom systems needing robust overvoltage protection.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,400 parts In-Stock

1+ parts

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2,400

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Digiode

USA . 915 parts In-Stock

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915

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 56 parts In-Stock

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56

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Distributors (Availability)

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AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$5.786

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-

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621

$5.786

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Parana Technologies

USA . 2,038 parts In-Stock

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$12.019

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$12.425

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2,038

$12.019

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$12.425

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DigiPath Technology Company

USA . 879 parts In-Stock

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$13.234

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$12.175

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879

$13.234

$12.175

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ChromeModa Solutions

Germany . 6,597 parts In-Stock

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$13.504

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$11.073

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6,597

$13.504

$11.073

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IDEA Electronic Components Group

UK . 296 parts In-Stock

1+ parts

$13.504

100+ parts

$12.829

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$12.154

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296

$13.504

$12.829

$12.154

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One Stop Electronics

USA . 468 parts In-Stock

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$54.000

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468

$54.000

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Kepictronics

USA . 43,500 parts In-Stock

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43,500

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A-Z Elektronik GmbH

Germany . 6,714 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

USA . 1,898 parts In-Stock

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1,898

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Perfect Parts

USA . 56 parts In-Stock

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56

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Overview

Enhance the reliability of your telecom systems with the TISP61089BD by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality protection ICs that offer peace of mind for your applications. Safeguard your equipment from surges and voltage spikes with this surge protection circuit, ensuring uninterrupted operation. With its compact design and industrial-grade temperature range, the TISP61089BD provides valuable protection while maximizing space efficiency. Trust Texas Instruments to provide superior telecom protection solutions for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring reliability in telecom applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options, allowing for versatile use in different telecom setups.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions commonly found in telecom installations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments, making it suitable for diverse locations.

Width: 3.9 mm

Narrow width makes this IC space-efficient, allowing for compact designs in telecom equipment.

Length: 4.9 mm

The compact length of the IC contributes to overall space savings, especially in densely packed telecom systems.

Terminal Form: GULL WING

Gull wing terminals provide secure connections to the PCB, reducing the risk of disconnections or signal loss in telecom applications.

Technical Specifications

Telecom - Protection ICs TISP61089BD attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61089BD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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