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LCP02-150B1

STMicroelectronics

LCP02-150B1 by STMicroelectronics

LCP02-150B1 by STMicroelectronics is a surge protection IC designed for telecom applications. It features an operating temp range of -20 °C to 85°C, an 8-terminal gull-wing design, and comes in a compact rectangular package. Ideal for safeguarding sensitive electronic components from voltage spikes.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Chip Stock

USA . 38,888 parts In-Stock

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Vyrian

USA . 1,948 parts In-Stock

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Anansix

USA . 1,392 parts In-Stock

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Digiode

USA . 1,121 parts In-Stock

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ComSIT Distribution GmbH

Germany . 720 parts In-Stock

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720

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Bristol Electronics

USA . 539 parts In-Stock

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539

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Manoshevitz Elec. Sales

Israel . 400 parts In-Stock

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400

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LIBRA Elektronik GmbH

Germany . 305 parts In-Stock

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305

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Semi Source

USA . 70 parts In-Stock

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PC Components Company LLC

USA . 28 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 244 parts In-Stock

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$14.169

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$12.752

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$12.752

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AZTECH Wire

Italy . 49 parts In-Stock

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$14.790

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49

$14.790

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MKK Technologies

India . 2,242 parts In-Stock

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$26.644

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DigiPath Technology Company

USA . 2,242 parts In-Stock

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$26.644

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RC Electronics

USA . 46,758 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,872 parts In-Stock

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Corphita

USA . 4,612 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,248 parts In-Stock

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Kepictronics

USA . 103 parts In-Stock

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Parana Technologies

USA . 14 parts In-Stock

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$16.941

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Perfect Parts

USA . 12 parts In-Stock

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Overview

Elevate your telecom designs with the LCP02-150B1 from STMicroelectronics—a leader in innovation and reliability. This cutting-edge surge protection IC ensures optimal performance, safeguarding your systems against voltage spikes while maintaining compact form factors. With a robust operating range and superior material quality, STMicroelectronics delivers unmatched value and peace of mind for applications demanding durability and efficiency. Choose excellence; choose LCP02-150B1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stress, making it suitable for various telecom applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact board designs, improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB, enabling better layout design and greater component density.

No. of Terminals: 8

With 8 terminals, the device offers ample connection options for enhancing circuit designs while maintaining a low footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space efficiency, making it ideal for compact telecom equipment where board real estate is at a premium.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderately high-temperature environments typical in telecom applications.

Minimum Operating Temperature: -20 °C

Operating at temperatures as low as -20 °C ensures versatility and reliability in diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and reliable electrical connections, extending the product's lifespan.

Terminal Position: DUAL

The dual terminal position allows for flexible wiring options, which can simplify circuit design and improve connection reliability.

Maximum Seated Height: 2.5 mm

A low maximum seated height of 2.5 mm helps maintain a slim profile in compact applications, thereby providing design flexibility.

Width: 5.62 mm

With a width of only 5.62 mm, the component is well-suited for tight spaces within telecom devices, maximizing PCB space utilization.

Terminal Form: GULL WING

Gull wing terminal form ensures easy soldering and dependable connections, simplifying the manufacturing process.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC provides essential safeguarding against voltage spikes, critical for ensuring the longevity of telecom equipment.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of handling, facilitating automated assembly processes.

Technical Specifications

Telecom - Protection ICs LCP02-150B1 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.62 mm

Trade Compliance

LCP02-150B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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