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LCP02-150M-TR

STMicroelectronics

LCP02-150M-TR by STMicroelectronics

LCP02-150M-TR by STMicroelectronics is a surge protection IC designed for telecom applications. It features a max operating temp of 85 °C, 10 terminals in a small outline package, and operates effectively b/w -20°C to 85°C. Ideal for safeguarding sensitive electronics from voltage spikes.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,338 parts In-Stock

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1,338

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Vyrian

USA . 528 parts In-Stock

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528

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Digiode

USA . 164 parts In-Stock

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164

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ComSIT Distribution GmbH

Germany . 94 parts In-Stock

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94

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IDEA Electronic Components Group

UK . 1,497 parts In-Stock

1+ parts

$8.367

100+ parts

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1k+ parts

$7.531

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1,497

$8.367

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$7.531

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MKK Technologies

India . 327 parts In-Stock

1+ parts

$15.734

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327

$15.734

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DigiPath Technology Company

USA . 327 parts In-Stock

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$15.734

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327

$15.734

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Perfect Parts

USA . 65,856 parts In-Stock

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65,856

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Cyclops Electronics Ltd (Excess)

UK . 29,400 parts In-Stock

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29,400

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 7,170 parts In-Stock

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7,170

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Alle Elektronik GmbH

Germany . 4,780 parts In-Stock

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4,780

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Corphita

USA . 3,986 parts In-Stock

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3,986

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Parana Technologies

USA . 971 parts In-Stock

1+ parts

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$10.004

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971

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$10.004

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Overview

Elevate your telecom designs with the LCP02-150M-TR from STMicroelectronics. This robust surge protection IC ensures reliable performance in diverse applications, safeguarding your equipment against voltage spikes. Renowned for their innovation and quality, STMicroelectronics delivers peace of mind to engineers and manufacturers alike. With a compact footprint and superior thermal management, this dependable solution not only enhances device longevity but also optimizes operational efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers good insulation and durability, ensuring reliable performance under various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easier installation and improved performance in automated assembly processes.

Package Shape: RECTANGULAR

The rectangular design optimizes the layout on printed circuit boards, enhancing space efficiency.

No. of Terminals: 10

Having 10 terminals provides flexibility in circuit design and compatibility with a variety of applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding thermal environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the IC to function in colder environments, broadening its applicability.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and resistance to corrosion, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning aids in balanced electrical performance and ease of access in circuit configurations.

Maximum Seated Height: 3.75 mm

With a low seated height, this IC can fit into tightly packed designs, making it versatile for various applications.

Width: 7.5 mm

The compact width allows for effective space utilization on the PCB while still providing robust performance.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum reflow time of 40 seconds minimizes thermal stress on the component during soldering processes.

Peak Reflow Temperature: 250 °C

A peak reflow temperature of 250 °C ensures compatibility with standard soldering processes and materials.

Length: 9.4 mm

The length of 9.4 mm maintains a compact design while allowing for a sufficient number of connections.

Terminal Form: GULL WING

Gull wing terminals enable strong solder joints and facilitate easy inspection during assembly.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Designed specifically for surge protection, this IC enhances the reliability and longevity of telecom equipment.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compact design while ensuring easy soldering and connectivity.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, requiring standard ESD precautions, which is manageable in typical environments.

Technical Specifications

Telecom - Protection ICs LCP02-150M-TR attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

LCP02-150M-TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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