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SMP80MC-160

STMicroelectronics

SMP80MC-160 by STMicroelectronics

SMP80MC-160 by STMicroelectronics is a surge protection circuit designed for telecom applications. It features a compact rectangular package with a max height of 2.65 mm, and operates at peak reflow temperatures up to 260 °C. This surface-mount IC ensures reliable performance in protecting sensitive electronics from voltage spikes.

Median Price

$1.070

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,264 parts In-Stock

1+ parts

$1.070

100+ parts

$0.437

1k+ parts

$0.306

10k+ parts

$0.239

2,264

$1.070

$0.437

$0.306

$0.239

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,030 parts In-Stock

1+ parts

$1.016

100+ parts

-

1k+ parts

-

10k+ parts

-

2,030

$1.016

-

-

-

Vyrian

USA . 3,018 parts In-Stock

1+ parts

$1.070

100+ parts

-

1k+ parts

-

10k+ parts

-

3,018

$1.070

-

-

-

Anansix

USA . 893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

893

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,007 parts In-Stock

1+ parts

$0.963

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$0.963

-

-

-

IDEA Electronic Components Group

UK . 820 parts In-Stock

1+ parts

$13.961

100+ parts

-

1k+ parts

$12.565

10k+ parts

-

820

$13.961

-

$12.565

-

MKK Technologies

India . 2,310 parts In-Stock

1+ parts

$26.253

100+ parts

-

1k+ parts

-

10k+ parts

-

2,310

$26.253

-

-

-

DigiPath Technology Company

USA . 2,310 parts In-Stock

1+ parts

$26.253

100+ parts

-

1k+ parts

-

10k+ parts

-

2,310

$26.253

-

-

-

Component Stockers USA

USA . 225 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$99.990

-

-

-

Kepictronics

USA . 88,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

88,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,518

-

-

-

-

Perfect Parts

USA . 2,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,539

-

-

-

-

Parana Technologies

USA . 1,946 parts In-Stock

1+ parts

-

100+ parts

$16.692

1k+ parts

-

10k+ parts

-

1,946

-

$16.692

-

-

Overview

Elevate your telecommunications projects with the SMP80MC-160 by STMicroelectronics, a leading name in innovation and reliability. This surge protection IC ensures robust defense against voltage spikes, safeguarding your valuable equipment and enhancing system longevity. Its compact design and superior performance make it an ideal choice for a range of applications, providing exceptional value and peace of mind for engineers and manufacturers alike. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides excellent durability and protection against environmental factors, making this IC suitable for various telecom applications.

Surface Mount: YES

Being surface mountable enhances its compatibility with modern PCB designs, allowing for efficient space utilization and ease of assembly in telecommunications devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for better placement and arrangement on circuit boards, which can improve signal integrity and reduce the footprint of the overall design.

No. of Terminals: 2

With only two terminals, this IC simplifies the integration process into existing circuits and minimizes potential failure points.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on the PCB, making it ideal for compact telecom designs without sacrificing performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and resistance to oxidation, ensuring reliability in electrical connections over prolonged use.

Terminal Position: DUAL

Dual terminal positioning provides versatile installation options, enhancing design flexibility in various telecom applications.

Maximum Seated Height: 2.65 mm

A maximum seated height of 2.65 mm keeps the IC profiles low, allowing for more compact device designs and contributing to space savings in tight environments.

Width: 3.625 mm

At a width of 3.625 mm, the IC can fit into tighter layouts, making it perfect for miniaturization efforts in telecom devices.

Maximum Time At Peak Reflow Temperature (s): 30

Specifying a maximum reflow time of 30 seconds ensures that the IC is designed to withstand soldering processes, enhancing manufacturing yield.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C demonstrates the IC's robustness during assembly, accommodating high-temperature soldering processes typically used in modern electronics.

Length: 4.325 mm

At a length of 4.325 mm, this compact design is optimized for space-constrained applications without compromising functionality.

Terminal Form: C BEND

The C bend terminal form allows for reliable connections and is designed to facilitate effective soldering during the manufacturing process.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC provides essential safeguarding against voltage spikes, significantly enhancing the reliability and longevity of telecom equipment.

Technical Specifications

Telecom - Protection ICs SMP80MC-160 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Length:

4.325 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.625 mm

Trade Compliance

SMP80MC-160 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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