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THBT27011DRL

STMicroelectronics

THBT27011DRL by STMicroelectronics

STMicroelectronics' THBT27011DRL is a Telecom IC with surge protection circuit. It features 8 terminals in small outline package, matte tin/nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring surface mount protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,585 parts In-Stock

1+ parts

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11,585

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Anansix

USA . 1,832 parts In-Stock

1+ parts

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1,832

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Digiode

USA . 981 parts In-Stock

1+ parts

-

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981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 297 parts In-Stock

1+ parts

$9.855

100+ parts

-

1k+ parts

$8.870

10k+ parts

-

297

$9.855

-

$8.870

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MKK Technologies

India . 160 parts In-Stock

1+ parts

$18.532

100+ parts

-

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160

$18.532

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DigiPath Technology Company

USA . 160 parts In-Stock

1+ parts

$18.532

100+ parts

-

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160

$18.532

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-

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AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$21.950

100+ parts

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190

$21.950

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Corphita

USA . 1,298 parts In-Stock

1+ parts

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1,298

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Parana Technologies

USA . 629 parts In-Stock

1+ parts

-

100+ parts

$11.783

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629

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$11.783

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Overview

Upgrade your telecom systems with the THBT27011DRL surge protection circuit from STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable solutions for the telecom industry. This small outline package with gull wing terminals offers excellent protection and peace of mind for your valuable equipment. Prevent damage from power surges and ensure uninterrupted communication with this essential component. Trust STMicroelectronics to provide the best protection ICs for all your telecom needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, making it suitable for telecom applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on PCBs, saving valuable space in telecom equipment.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing telecom hardware designs.

No. of Terminals: 8

Having 8 terminals gives flexibility in connecting the IC to other components in the telecom system.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space and reducing overall size of the telecom device.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures good connectivity and resistance to corrosion, enhancing the reliability of the IC.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity in telecom applications.

Maximum Seated Height: 1.75 mm

Low seated height makes the IC suitable for compact telecom equipment where vertical space is limited.

Width: 3.9 mm

Narrow width allows for placement in tight spaces within telecom devices, optimizing layout and design.

Length: 4.9 mm

Compact length contributes to space-saving and efficient use of board real estate in telecom systems.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable connections in telecom applications.

Telecom IC Type: SURGE PROTECTION CIRCUIT

This surge protection circuit provides an essential safeguard for telecom equipment against power surges and ensures uninterrupted operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting of the IC on the PCB, optimizing space usage in telecom devices.

Technical Specifications

Telecom - Protection ICs THBT27011DRL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3/e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

THBT27011DRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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