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THBT27011D

STMicroelectronics

THBT27011D by STMicroelectronics

STMicroelectronics THBT27011D is a Telecom IC with surge protection circuit. It features 8 terminals in a small outline package, measuring 3.9mm x 4.9mm with a seated height of 1.75mm. Ideal for telecom applications requiring surface mount protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,922 parts In-Stock

1+ parts

-

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2,922

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-

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Anansix

USA . 2,852 parts In-Stock

1+ parts

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-

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2,852

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Digiode

USA . 1,683 parts In-Stock

1+ parts

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1,683

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Lantek

USA . 400 parts In-Stock

1+ parts

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400

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LWI Electronics Inc

India . 36 parts In-Stock

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36

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,092 parts In-Stock

1+ parts

$11.762

100+ parts

-

1k+ parts

$10.586

10k+ parts

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2,092

$11.762

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$10.586

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MKK Technologies

India . 954 parts In-Stock

1+ parts

$22.118

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-

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954

$22.118

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DigiPath Technology Company

USA . 954 parts In-Stock

1+ parts

$22.118

100+ parts

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954

$22.118

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Metaverse IC Inc.

Canada . 1,750 parts In-Stock

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1,750

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Parana Technologies

USA . 1,625 parts In-Stock

1+ parts

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100+ parts

$14.064

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1,625

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$14.064

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Kepictronics

USA . 1,255 parts In-Stock

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1,255

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GreenTree Electronics

Israel . 400 parts In-Stock

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400

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Authorized Procurement Solutions

USA . 96 parts In-Stock

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96

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Corphita

USA . 70 parts In-Stock

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70

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Overview

Enhance the reliability of your telecom systems with the THBT27011D surge protection circuit by STMicroelectronics. This high-quality product offers superior protection for your equipment, ensuring uninterrupted communication and reducing the risk of damage from power surges. With its compact design and durable construction, this Telecom - Protection IC is ideal for a wide range of applications. Invest in the THBT27011D for peace of mind and safeguard your valuable assets against unexpected electrical disturbances. Trust STMicroelectronics for cutting-edge technology that delivers exceptional performance and unmatched durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring long-term functionality.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate this IC into various electronic devices and systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the IC to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact designs.

Terminal Finish: TIN LEAD

Tin lead finish ensures good conductivity and reliability in the terminal connections.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options, enhancing versatility in circuit designs.

Maximum Seated Height: 1.75 mm

Low seated height enables the IC to be easily accommodated in slim electronic devices and systems.

Width: 3.9 mm

Compact width ensures the IC can fit in confined spaces within the circuit layout.

Length: 4.9 mm

Short length facilitates efficient positioning of the IC on the PCB, minimizing signal interference.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable soldering connections, enhancing the IC's performance.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry helps safeguard sensitive telecom equipment from voltage fluctuations and transient surges.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for close spacing between terminals, enabling dense integration of components on the PCB.

Technical Specifications

Telecom - Protection ICs THBT27011D attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

THBT27011D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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