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NTSP1

STMicroelectronics

NTSP1 by STMicroelectronics

NTSP1 by STMicroelectronics is a surge protection circuit in a small outline package with 8 terminals. It features gull wing terminal form, tin lead finish, and measures 3.9mm in width and 4.9mm in length. Ideal for telecom applications requiring surface mount protection ICs with a rectangular package shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,100

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Anansix

USA . 1,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,272

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Vyrian

USA . 855 parts In-Stock

1+ parts

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100+ parts

-

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855

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ComSIT Distribution GmbH

Germany . 201 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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201

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 802 parts In-Stock

1+ parts

$7.081

100+ parts

-

1k+ parts

$6.373

10k+ parts

-

802

$7.081

-

$6.373

-

MKK Technologies

India . 1,607 parts In-Stock

1+ parts

$13.316

100+ parts

-

1k+ parts

-

10k+ parts

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1,607

$13.316

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-

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DigiPath Technology Company

USA . 1,607 parts In-Stock

1+ parts

$13.316

100+ parts

-

1k+ parts

-

10k+ parts

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1,607

$13.316

-

-

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Parana Technologies

USA . 1,790 parts In-Stock

1+ parts

-

100+ parts

$8.467

1k+ parts

-

10k+ parts

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1,790

-

$8.467

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Corphita

USA . 1,179 parts In-Stock

1+ parts

-

100+ parts

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1,179

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Kepictronics

USA . 447 parts In-Stock

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447

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Overview

Experience peace of mind with the NTSP1 by STMicroelectronics, a top-quality surge protection circuit designed to safeguard your telecom devices. Manufactured by the renowned STMicroelectronics, this protection IC offers unparalleled reliability and performance. Ideal for a wide range of applications in the telecom industry, the NTSP1 ensures your equipment is protected from unexpected power surges and spikes. Invest in the NTSP1 today and enjoy the value, benefits, and peace of mind that only superior quality can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight, durable, and provides good thermal management.

Surface Mount: YES

Surface mount components are easier to assemble and take up less space on the circuit board, making them more efficient and cost-effective.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle and integrate into a circuit design, providing a standard form factor for compatibility.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and flexibility in the circuit layout.

Package Style: SMALL OUTLINE

Small outline packages save space on the PCB and reduce overall system size, making them suitable for compact designs.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring reliable connections in the circuit.

Terminal Position: DUAL

Dual terminal positions offer redundant connections for added reliability and stability in the circuit.

Maximum Seated Height: 1.75 mm

Low seated height allows for slim and compact PCB designs, optimizing space usage in the system.

Width: 3.9 mm

Narrow width helps in fitting the component in tight spaces and enables efficient layout of the circuit board.

Length: 4.9 mm

Compact length makes the component suitable for small form factor applications and space-constrained designs.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and ease of soldering, ensuring secure connections on the PCB.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuits safeguard the telecom equipment from voltage spikes and transient surges, enhancing system reliability and longevity.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting of components, enabling compact and space-saving circuit designs.

Technical Specifications

Telecom - Protection ICs NTSP1 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

NTSP1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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