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CLP270M

STMicroelectronics

CLP270M by STMicroelectronics

STMicroelectronics' CLP270M is a telecom surge protection IC with 10 terminals in a small outline package. It features gull wing terminal form, 1.27mm pitch, and measures 7.5mm wide by 9.4mm long with a seated height of 3.75mm. Ideal for telecom applications requiring surface mount protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,651 parts In-Stock

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1,651

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Vyrian

USA . 1,310 parts In-Stock

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1,310

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Anansix

USA . 1,146 parts In-Stock

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1,146

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R&J Components

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 690 parts In-Stock

1+ parts

$2.602

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690

$2.602

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IDEA Electronic Components Group

UK . 2,275 parts In-Stock

1+ parts

$7.074

100+ parts

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$6.366

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2,275

$7.074

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$6.366

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MKK Technologies

India . 1,215 parts In-Stock

1+ parts

$13.302

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1,215

$13.302

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DigiPath Technology Company

USA . 1,215 parts In-Stock

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$13.302

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1,215

$13.302

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A-Z Elektronik GmbH

Germany . 7,299 parts In-Stock

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7,299

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Alle Elektronik GmbH

Germany . 4,866 parts In-Stock

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4,866

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Corphita

USA . 3,809 parts In-Stock

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3,809

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Parana Technologies

USA . 882 parts In-Stock

1+ parts

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$8.458

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882

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$8.458

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Native Components

USA . 419 parts In-Stock

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$2.295

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419

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$2.295

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Overview

Enhance the reliability and durability of your telecom equipment with the CLP270M from STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers top-notch protection ICs that ensure optimal performance and longevity for your devices. With its compact design and surge protection circuit, this product provides peace of mind against unexpected power surges, safeguarding your valuable telecom systems. Trust STMicroelectronics to provide quality solutions for all your telecom protection needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the protection IC, ensuring long-term reliability and ease of handling.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying assembly process.

Package Shape: RECTANGULAR

Efficient design that allows for optimal use of board space and easy placement in electronic systems.

No. of Terminals: 10

Sufficient number of terminals for connecting the protection IC to other components in the circuit, enabling versatile usage.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Compact size with built-in heat sink/slugs for efficient thermal management, ensuring stable performance under high loads.

Terminal Position: DUAL

Dual terminal position enhances flexibility in board layout and soldering, allowing for easier installation and connection.

Maximum Seated Height: 3.75 mm

Low profile design that saves space and facilitates integration in compact electronic devices.

Width: 7.5 mm

Narrow width that contributes to the overall compactness of the protection IC, ideal for space-constrained applications.

Length: 9.4 mm

Optimal length that ensures a balanced form factor and ease of placement on the circuit board.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections and mechanical stability, enhancing the reliability of the protection IC.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Specifically designed for protecting telecom equipment from voltage surges and spikes, safeguarding sensitive components in the system.

Terminal Pitch: 1.27 mm

Standard terminal pitch that facilitates compatibility with various circuit board designs and simplifies soldering processes.

Technical Specifications

Telecom - Protection ICs CLP270M attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G10

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

CLP270M Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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