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TISP8180KC-00

Texas Instruments

TISP8180KC-00 by Texas Instruments

TISP8180KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It features 2 functions, operates b/w 0°C to 70°C, and has a flange mount package style. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,964 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,964

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-

-

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Digiode

USA . 2,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,517

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,451 parts In-Stock

1+ parts

$8.929

100+ parts

-

1k+ parts

$9.599

10k+ parts

-

1,451

$8.929

-

$9.599

-

ChromeModa Solutions

Germany . 2,586 parts In-Stock

1+ parts

$10.033

100+ parts

$8.227

1k+ parts

-

10k+ parts

-

2,586

$10.033

$8.227

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$10.033

100+ parts

$9.531

1k+ parts

$9.030

10k+ parts

-

1,373

$10.033

$9.531

$9.030

-

AZTECH Wire

Italy . 230 parts In-Stock

1+ parts

$16.677

100+ parts

-

1k+ parts

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10k+ parts

-

230

$16.677

-

-

-

One Stop Electronics

USA . 1,447 parts In-Stock

1+ parts

$246.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,447

$246.000

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-

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Corphita

USA . 2,058 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,058

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-

-

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DigiPath Technology Company

USA . 546 parts In-Stock

1+ parts

-

100+ parts

$9.046

1k+ parts

-

10k+ parts

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546

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$9.046

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Overview

Unlock the power of reliable surge protection with the TISP8180KC-00 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. Designed for telecom applications, this surge protection circuit offers peace of mind and reliability. With a durable plastic/epoxy package and flange mount style, this IC is built to last. Ensure the safety of your equipment and maximize performance with the TISP8180KC-00. Trust Texas Instruments for superior protection and unmatched quality.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring long-lasting performance in telecom applications.

No. of Functions - 2

Having multiple functions in a single IC allows for more comprehensive protection in telecom systems.

Package Shape - RECTANGULAR

The rectangular shape makes it easy to integrate this IC into existing telecom equipment or circuit boards.

No. of Terminals - 3

Having three terminals provides flexibility in connecting the IC within a telecom system.

Package Style (Meter) - FLANGE MOUNT

The flange mount style allows for secure and stable placement of the IC in telecom equipment, increasing reliability.

Maximum Operating Temperature - 70 °C

With a high maximum operating temperature, this IC can withstand the heat generated in telecom environments, ensuring reliable operation.

Minimum Operating Temperature - 0 °C

The low minimum operating temperature ensures that this IC can function in a wide range of telecom environments, from cold to warm temperatures.

Terminal Position - SINGLE

Having a single terminal position simplifies the installation and connection of this IC within a telecom system.

Temperature Grade - COMMERCIAL

The commercial temperature grade indicates that this IC is designed for standard operating conditions in commercial telecom applications.

Terminal Form - THROUGH-HOLE

The through-hole terminal form allows for easy and secure soldering of the IC onto a circuit board, ensuring a reliable connection.

Telecom IC Type - SURGE PROTECTION CIRCUIT

This specific type of IC is essential for protecting telecom equipment from voltage spikes and ensuring the longevity of the overall system.

Technical Specifications

Telecom - Protection ICs TISP8180KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T3

No. of Functions:

2

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP8180KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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