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TISP61089P

Texas Instruments

TISP61089P by Texas Instruments

TISP61089P by Texas Instruments is a surge protection circuit for telecom applications. With 8 terminals, it has an industrial temperature grade of -40 to 85°C. The rectangular package style with through-hole terminals measures 7.62mm in width and 5.08mm in height.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 6,614 parts In-Stock

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Digiode

USA . 2,397 parts In-Stock

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BCID Electronics Ltd.

Israel . 88 parts In-Stock

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Speed Components Ltd

Israel . 88 parts In-Stock

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LWI Electronics Inc

India . 50 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 795 parts In-Stock

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$11.958

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795

$11.958

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Parana Technologies

USA . 999 parts In-Stock

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$15.164

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$15.564

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DigiPath Technology Company

USA . 1,730 parts In-Stock

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$16.697

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$16.697

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ChromeModa Solutions

Germany . 4,534 parts In-Stock

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$17.038

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$13.971

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IDEA Electronic Components Group

UK . 1,312 parts In-Stock

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$17.038

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$16.186

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$15.334

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One Stop Electronics

USA . 371 parts In-Stock

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$316.000

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Corphita

USA . 3,351 parts In-Stock

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Overview

Protect your telecom equipment with the TISP61089P by Texas Instruments, a top-quality surge protection circuit designed to safeguard against voltage spikes and ensure reliable performance. With Texas Instruments' reputation for excellence in manufacturing, this product offers unmatched durability and stability in a compact rectangular package. Ideal for a wide range of telecom applications, this versatile IC provides peace of mind for customers seeking superior protection for their valuable equipment. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection against environmental factors, ensuring durability and reliability in various conditions.

No. of Terminals: 8

Sufficient number of terminals for connecting to different components and circuits in a telecom system.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures commonly found in telecom equipment without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold environments, making it suitable for various installation locations.

Maximum Seated Height: 5.08 mm

Compact size allows for easy integration into the telecom system without taking up too much space.

Width: 7.62 mm

Narrow width enables flexibility in placement within the equipment, optimizing use of available space.

Temperature Grade: INDUSTRIAL

Meets industrial standards for temperature tolerance, ensuring reliable operation in harsh conditions.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Essential for protecting telecom equipment from power surges, enhancing the longevity of the system.

Terminal Pitch: 2.54 mm

Standard terminal pitch for compatibility with various PCB layouts and connectors, facilitating easy installation.

Technical Specifications

Telecom - Protection ICs TISP61089P attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TISP61089P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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