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TISP61089DR

Texas Instruments

TISP61089DR by Texas Instruments

TISP61089DR by Texas Instruments is a Telecom IC with surge protection circuit. It has 8 terminals, operates b/w -40 to 85°C, and comes in a small outline package. Ideal for telecom applications requiring protection against surges in industrial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,069 parts In-Stock

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5,069

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Digiode

USA . 3,581 parts In-Stock

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Bristol Electronics

USA . 2,498 parts In-Stock

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Electronics Depot

USA . 1,835 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 750 parts In-Stock

1+ parts

$14.497

100+ parts

$1,346.286

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$13.047

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750

$14.497

$1,346.286

$13.047

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DigiPath Technology Company

USA . 1,312 parts In-Stock

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$15.963

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ChromeModa Solutions

Germany . 5,248 parts In-Stock

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$16.289

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$13.357

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$16.289

$13.357

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IDEA Electronic Components Group

UK . 1,454 parts In-Stock

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$16.289

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$15.475

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$14.660

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1,454

$16.289

$15.475

$14.660

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AZTECH Wire

Italy . 850 parts In-Stock

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$19.289

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$19.289

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One Stop Electronics

USA . 718 parts In-Stock

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$334.000

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718

$334.000

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Kepictronics

USA . 2,891 parts In-Stock

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Assy Fe

Spain . 1,460 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corphita

USA . 1,306 parts In-Stock

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Montclair Electronics, Inc.

USA . 3 parts In-Stock

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Overview

Protect your telecom equipment with the TISP61089DR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that provide reliable surge protection for your devices. Ideal for telecom applications, this surge protection circuit offers peace of mind and added security to your systems. Trust Texas Instruments to deliver exceptional value and unmatched performance with the TISP61089DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of robust plastic/epoxy material ensures durability and protection against external elements, making this product suitable for long-term use in telecom applications.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for space-efficient packing and placement on PCBs, optimizing the use of available board space.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for integration with various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in reducing the overall footprint of the device, making it ideal for compact telecom systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures, ensuring reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this product to function effectively even in extreme cold conditions, making it suitable for a wide range of operating environments.

Terminal Position: DUAL

Having dual terminal positions allows for increased flexibility in mounting and connectivity options, accommodating different PCB layouts.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm contributes to a compact design, making this product suitable for applications where space is limited.

Width: 3.9 mm

With a narrow width of 3.9 mm, this product is well-suited for applications that require efficient use of board space and compact design.

Length: 4.9 mm

The short length of 4.9 mm further enhances the compactness of this product, making it an ideal choice for telecom applications with space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade performance, this product can reliably operate in harsh industrial environments, ensuring continuous protection for telecom systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy surface mounting and soldering processes, enhancing the overall assembly efficiency of the product.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this product offers essential protection against voltage spikes and surges, safeguarding telecom equipment from potential damage.

Terminal Pitch: 1.27 mm

With a small terminal pitch of 1.27 mm, this product allows for compact interconnection on PCBs, enabling efficient signal routing and connectivity in telecom applications.

Technical Specifications

Telecom - Protection ICs TISP61089DR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61089DR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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