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TISPPBL2DR

Texas Instruments

TISPPBL2DR by Texas Instruments

TISPPBL2DR by Texas Instruments is a Telecom Surge Protection IC with 8 terminals in a small outline package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features gull wing terminals and offers surge protection for telecom systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 50,000 parts In-Stock

1+ parts

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50,000

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ComSIT Distribution GmbH

Germany . 39,036 parts In-Stock

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39,036

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Cyclops Electronics Ltd

UK . 24,350 parts In-Stock

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24,350

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Manoshevitz Elec. Sales

Israel . 5,280 parts In-Stock

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5,280

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Vyrian

USA . 5,156 parts In-Stock

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5,156

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Digiode

USA . 3,778 parts In-Stock

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3,778

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Distributors (Availability)

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Parana Technologies

USA . 1,483 parts In-Stock

1+ parts

$15.525

100+ parts

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$15.900

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1,483

$15.525

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$15.900

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DigiPath Technology Company

USA . 452 parts In-Stock

1+ parts

$17.095

100+ parts

$15.728

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452

$17.095

$15.728

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ChromeModa Solutions

Germany . 4,790 parts In-Stock

1+ parts

$17.444

100+ parts

$14.304

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4,790

$17.444

$14.304

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IDEA Electronic Components Group

UK . 718 parts In-Stock

1+ parts

$17.444

100+ parts

$16.572

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$15.700

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718

$17.444

$16.572

$15.700

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AZTECH Wire

Italy . 371 parts In-Stock

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$18.330

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371

$18.330

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One Stop Electronics

USA . 591 parts In-Stock

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$218.000

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591

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Kepictronics

USA . 50,000 parts In-Stock

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Assy Fe

Spain . 13,734 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,958 parts In-Stock

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Corphita

USA . 1,472 parts In-Stock

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Overview

Upgrade your telecom systems with the TISPPBL2DR by Texas Instruments, a top-quality surge protection circuit that ensures the safety and reliability of your equipment. With a trusted manufacturer like Texas Instruments, you can rest assured that you are getting a product that is built to last. Ideal for telecom applications, this protection IC offers peace of mind against power surges and ensures uninterrupted communication. Invest in the TISPPBL2DR today and safeguard your valuable telecom equipment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection against external elements, making it suitable for use in telecom equipment.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into telecom devices, saving space and enhancing efficiency.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor that is compatible with a wide range of telecom equipment, offering versatility in application.

No. of Terminals: 8

Having 8 terminals allows for multiple connection options, enabling flexibility in circuit design and configuration.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact designs, ideal for telecom applications where size constraints are present.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions, making the product suitable for industrial use.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature extends the range of operating environments, ensuring performance in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved connectivity, enhancing the reliability of the product in telecom applications.

Maximum Seated Height: 1.75 mm

Low seated height allows for a slim profile, reducing the overall size of the device and facilitating installation in tight spaces.

Width: 3.9 mm

Narrow width offers space-saving benefits, enabling compact designs and efficient use of PCB real estate in telecom equipment.

Length: 4.9 mm

Compact length contributes to the overall small form factor of the product, making it suitable for space-constrained telecom applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh operating conditions typically found in telecom environments, enhancing reliability and longevity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and PCB mounting, simplifying assembly processes and ensuring secure electrical connections.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Incorporating surge protection circuitry helps safeguard telecom devices from voltage spikes and surges, enhancing the overall reliability and longevity of the equipment.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting, enabling more functionalities in a compact space and making it suitable for telecom applications with limited board space.

Technical Specifications

Telecom - Protection ICs TISPPBL2DR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISPPBL2DR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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