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TISP61089ASD

Texas Instruments

TISP61089ASD by Texas Instruments

TISP61089ASD by Texas Instruments is a Telecom Surge Protection IC with 8 terminals, operating temperature range of -40 to 85°C. Its small outline package is surface mountable and made of plastic/epoxy. Ideal for industrial telecom applications requiring surge protection in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,937 parts In-Stock

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3,937

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,935 parts In-Stock

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1,935

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Digiode

USA . 1,760 parts In-Stock

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1,760

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ComSIT Distribution GmbH

Germany . 600 parts In-Stock

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600

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Distributors (Availability)

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Parana Technologies

USA . 886 parts In-Stock

1+ parts

$7.304

100+ parts

-

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$7.799

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886

$7.304

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$7.799

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DigiPath Technology Company

USA . 280 parts In-Stock

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$8.043

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$7.399

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280

$8.043

$7.399

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ChromeModa Solutions

Germany . 6,540 parts In-Stock

1+ parts

$8.207

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$6.730

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6,540

$8.207

$6.730

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IDEA Electronic Components Group

UK . 97 parts In-Stock

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$8.207

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$7.386

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97

$8.207

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$7.386

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AZTECH Wire

Italy . 242 parts In-Stock

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$19.598

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242

$19.598

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One Stop Electronics

USA . 322 parts In-Stock

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$521.000

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322

$521.000

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Corphita

USA . 4,167 parts In-Stock

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4,167

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Kepictronics

USA . 3,200 parts In-Stock

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3,200

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Upgrade your telecom system with the TISP61089ASD by Texas Instruments, a top-of-the-line surge protection circuit designed to safeguard your equipment from power surges and voltage spikes. With a small outline package style and dual terminal position, this high-quality IC offers industrial-grade performance with a wide operating temperature range. Trust in Texas Instruments' reputation for excellence in manufacturing and experience peace of mind knowing your telecom devices are protected. Enhance the reliability and longevity of your telecommunications infrastructure with the TISP61089ASD today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the internal components of the IC.

Surface Mount: YES

Makes it easy to mount the IC directly onto a PCB, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board.

No. of Terminals: 8

Provides multiple connection points for a secure and reliable electrical connection.

Package Style: SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature environments, enhancing its versatility.

Terminal Position: DUAL

Dual terminal position provides flexibility in the layout and connection of the IC.

Maximum Seated Height: 1.75 mm

Low seated height helps in designing slim and compact devices.

Width: 3.9 mm

Narrow width allows for efficient use of space on the PCB.

Length: 4.9 mm

Compact length helps in designing smaller electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial settings where temperature fluctuations are common.

Terminal Form: GULL WING

Gull wing terminals provide a strong and reliable connection to the PCB.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Offers protection against voltage surges, ensuring the safety and reliability of the connected telecom equipment.

Terminal Pitch: 1.27 mm

Provides a standard pitch for easy integration into existing PCB designs.

Technical Specifications

Telecom - Protection ICs TISP61089ASD attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61089ASD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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