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TISPPBL2SD

Texas Instruments

TISPPBL2SD by Texas Instruments

TISPPBL2SD by Texas Instruments is a Telecom Surge Protection IC with 8 terminals, Gull Wing form, and small outline package. It operates b/w -40 to 85°C, ideal for industrial applications requiring protection against surges in telecom systems. The rectangular plastic/epoxy body measures 3.9mm in width and 4.9mm in length, making it suitable for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,272 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,272

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Digiode

USA . 2,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,484

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$9.127

100+ parts

-

1k+ parts

-

10k+ parts

-

869

$9.127

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-

-

Parana Technologies

USA . 938 parts In-Stock

1+ parts

$14.163

100+ parts

$1,315.292

1k+ parts

$12.747

10k+ parts

-

938

$14.163

$1,315.292

$12.747

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DigiPath Technology Company

USA . 1,981 parts In-Stock

1+ parts

$15.596

100+ parts

-

1k+ parts

-

10k+ parts

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1,981

$15.596

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-

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ChromeModa Solutions

Germany . 1,652 parts In-Stock

1+ parts

$15.914

100+ parts

$13.049

1k+ parts

-

10k+ parts

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1,652

$15.914

$13.049

-

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IDEA Electronic Components Group

UK . 1,604 parts In-Stock

1+ parts

$15.914

100+ parts

$15.118

1k+ parts

$14.323

10k+ parts

-

1,604

$15.914

$15.118

$14.323

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One Stop Electronics

USA . 907 parts In-Stock

1+ parts

$268.000

100+ parts

-

1k+ parts

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10k+ parts

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907

$268.000

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Corphita

USA . 3,094 parts In-Stock

1+ parts

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3,094

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Overview

Protect your telecom equipment with the TISPPBL2SD surge protection circuit by Texas Instruments. With a commitment to quality and reliability, Texas Instruments offers a small outline package design that is easy to mount and fits seamlessly into your system. Ideal for industrial applications, this telecom protection IC ensures your equipment operates safely in a wide range of temperatures from -40 to 85°C. Trust Texas Instruments to provide the protection your valuable equipment needs, so you can focus on what matters most – your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount option makes it easy to integrate into PCB designs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, enabling compact and streamlined designs.

No. of Terminals: 8

With 8 terminals, the product can accommodate multiple connections, providing flexibility in circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in a variety of environments, making the product suitable for industrial applications.

Width: 3.9 mm

Compact width allows for space-saving integration into tight PCB layouts, enabling versatile design options.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable performance in harsh operating conditions, making the product suitable for rugged applications.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry helps safeguard sensitive telecom equipment from voltage spikes, ensuring reliable operation and protection against damage.

Technical Specifications

Telecom - Protection ICs TISPPBL2SD attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISPPBL2SD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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