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THBT15011D

STMicroelectronics

THBT15011D by STMicroelectronics

STMicroelectronics THBT15011D is a Telecom Protection IC with 8 terminals in a small outline package. It offers surge protection circuitry, operates b/w 0-70 °C, and features tin lead terminal finish. Ideal for telecom applications requiring compact, surface-mountable surge protection solutions.

Median Price

$15.113

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$15.113

100+ parts

-

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300

$15.113

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Digiode

USA . 4,624 parts In-Stock

1+ parts

-

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4,624

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Anansix

USA . 1,066 parts In-Stock

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1,066

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Vyrian

USA . 145 parts In-Stock

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145

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ComSIT Distribution GmbH

Germany . 62 parts In-Stock

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62

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ComSIT USA

USA . 62 parts In-Stock

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62

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LWI Electronics Inc

India . 48 parts In-Stock

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,121 parts In-Stock

1+ parts

$9.134

100+ parts

-

1k+ parts

$8.220

10k+ parts

-

1,121

$9.134

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$8.220

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MKK Technologies

India . 1,752 parts In-Stock

1+ parts

$17.175

100+ parts

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1,752

$17.175

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DigiPath Technology Company

USA . 1,752 parts In-Stock

1+ parts

$17.175

100+ parts

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1k+ parts

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1,752

$17.175

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A-Z Elektronik GmbH

Germany . 4,824 parts In-Stock

1+ parts

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4,824

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Corphita

USA . 3,393 parts In-Stock

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3,393

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Parana Technologies

USA . 1,223 parts In-Stock

1+ parts

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100+ parts

$10.921

1k+ parts

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10k+ parts

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1,223

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$10.921

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Overview

Upgrade your telecom systems with the THBT15011D surge protection circuit by STMicroelectronics. Designed with the highest quality materials and cutting-edge technology, this small outline package offers reliable protection for your telecommunications equipment. Ensure peace of mind with this dual terminal device that can withstand a wide range of temperatures while providing optimal performance. Trust in STMicroelectronics to deliver superior products that exceed industry standards, keeping your telecom systems safe and secure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to fit the IC into various design layouts, providing flexibility in placement within electronic devices.

No. of Terminals: 8

With enough terminals for connectivity, this IC can support multiple functions and connections in a telecom system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of environments, making it versatile for various applications.

Terminal Finish: TIN LEAD

The tin lead finish provides good conductivity and solderability, ensuring secure connections and efficient performance.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Designed specifically for surge protection in telecom systems, this IC helps prevent damage from sudden voltage spikes, ensuring the safety of connected devices.

Technical Specifications

Telecom - Protection ICs THBT15011D attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

THBT15011D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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