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THBT16011DRL

STMicroelectronics

THBT16011DRL by STMicroelectronics

STMicroelectronics THBT16011DRL is a Telecom IC with surge protection circuit. It features 8 terminals in small outline package, nickel palladium gold finish, and gull wing form. Ideal for telecom applications requiring surface mount protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 16,650 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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16,650

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-

-

-

Vyrian

USA . 4,681 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,681

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-

-

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Anansix

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,740

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-

-

-

Digiode

USA . 1,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,526

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,709 parts In-Stock

1+ parts

$10.248

100+ parts

-

1k+ parts

$9.223

10k+ parts

-

1,709

$10.248

-

$9.223

-

MKK Technologies

India . 311 parts In-Stock

1+ parts

$19.270

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$19.270

-

-

-

DigiPath Technology Company

USA . 311 parts In-Stock

1+ parts

$19.270

100+ parts

-

1k+ parts

-

10k+ parts

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311

$19.270

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-

-

Corphita

USA . 4,244 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,244

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-

-

-

Parana Technologies

USA . 403 parts In-Stock

1+ parts

-

100+ parts

$12.253

1k+ parts

-

10k+ parts

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403

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$12.253

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Overview

Upgrade your telecom systems with the THBT16011DRL from STMicroelectronics, a leading manufacturer known for top-quality protection ICs. This small outline surge protection circuit offers invaluable benefits such as safeguarding your equipment against power surges and ensuring reliable performance. With its dual terminal position and nickel palladium gold finish, this product promises ease of installation and durability. Trust STMicroelectronics to provide you with cutting-edge solutions for your telecom needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making this product suitable for telecom applications where resistance to environmental factors is important.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape ensures easy integration into existing circuit designs and saves space on the PCB.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the protection IC to other components in the circuit, allowing for versatile usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style makes this product compact and suitable for applications where space constraints are a concern.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures reliable electrical connections, enhancing the overall performance and longevity of the protection IC.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures a stable connection, making this product a reliable choice for critical telecom systems.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for a compact design and easy integration into space-constrained telecom equipment.

Width: 3.9 mm

Narrow width facilitates a space-saving design, ideal for telecom applications where board space is limited.

Length: 4.9 mm

Compact length ensures the protection IC can fit into tight spaces on the PCB, making it a versatile choice for various telecom devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering, ensuring a secure connection in telecom applications with potential vibration or movement.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuit design helps safeguard telecom equipment from voltage spikes and fluctuations, enhancing the reliability and longevity of the overall system.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting on the PCB, making this protection IC suitable for telecom devices with compact layouts.

Technical Specifications

Telecom - Protection ICs THBT16011DRL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

THBT16011DRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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