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LCDP1511D

STMicroelectronics

LCDP1511D by STMicroelectronics

STMicroelectronics' LCDP1511D is a surge protection circuit in a small outline package with 8 terminals. It features gull wing terminal form, 1.27mm pitch, and measures 3.9mm wide by 4.9mm long for telecom applications requiring surface mount protection ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,923 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,923

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Anansix

USA . 2,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,839

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-

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Vyrian

USA . 2,812 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,812

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,082 parts In-Stock

1+ parts

$7.698

100+ parts

-

1k+ parts

$6.928

10k+ parts

-

2,082

$7.698

-

$6.928

-

MKK Technologies

India . 1,757 parts In-Stock

1+ parts

$14.475

100+ parts

-

1k+ parts

-

10k+ parts

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1,757

$14.475

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-

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DigiPath Technology Company

USA . 1,757 parts In-Stock

1+ parts

$14.475

100+ parts

-

1k+ parts

-

10k+ parts

-

1,757

$14.475

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-

-

Corphita

USA . 2,075 parts In-Stock

1+ parts

-

100+ parts

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2,075

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Parana Technologies

USA . 934 parts In-Stock

1+ parts

-

100+ parts

$9.204

1k+ parts

-

10k+ parts

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934

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$9.204

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-

Overview

Enhance the reliability of your telecom systems with the LCDP1511D by STMicroelectronics. Crafted with precision and expertise, this surge protection circuit ensures top-notch quality and performance. Perfect for safeguarding your valuable equipment from power surges, this protection IC offers peace of mind and uninterrupted service. Trust in the reputable manufacturer, STMicroelectronics, known for delivering innovative solutions to meet industry demands. Upgrade your telecom setup with the LCDP1511D and experience unparalleled protection and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the Telecom IC, ensuring reliability in harsh environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor that is easy to work with for design and assembly purposes.

No. of Terminals: 8

With 8 terminals available, this Telecom IC can accommodate multiple connections, providing flexibility in system design and connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB, making it suitable for compact designs and applications where size constraints are present.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved electrical connections, enhancing the overall reliability and performance of the Telecom IC.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a flat and compact profile, making it suitable for applications where space is limited and height restrictions are important.

Width: 3.9 mm

The narrow width of the Telecom IC makes it suitable for compact designs and applications where board space is limited, enabling efficient use of space.

Length: 4.9 mm

The compact length of the Telecom IC contributes to its space-saving design, making it ideal for applications where size constraints are crucial.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and reliability during soldering processes, ensuring secure and robust connections for the Telecom IC.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this Telecom IC can safeguard sensitive telecommunications equipment from voltage spikes and transient surges, enhancing the longevity and reliability of the system.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density mounting on the PCB, allowing for efficient use of board space and enabling versatile placement options for the Telecom IC.

Technical Specifications

Telecom - Protection ICs LCDP1511D attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LCDP1511D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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