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LCDP1521

STMicroelectronics

LCDP1521 by STMicroelectronics

LCDP1521 by STMicroelectronics is a surge protection IC designed for telecom applications. It features an industrial temp range of -40 °C to 85 °C, an 8-terminal gull-wing package, and a peak reflow temp of 260 °C. Ideal for enhancing circuit reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,265

-

-

-

-

Vyrian

USA . 2,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,141

-

-

-

-

Digiode

USA . 1,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$14.413

100+ parts

-

1k+ parts

$12.971

10k+ parts

-

1,067

$14.413

-

$12.971

-

AZTECH Wire

Italy . 959 parts In-Stock

1+ parts

$19.800

100+ parts

-

1k+ parts

-

10k+ parts

-

959

$19.800

-

-

-

MKK Technologies

India . 7 parts In-Stock

1+ parts

$27.102

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$27.102

-

-

-

DigiPath Technology Company

USA . 7 parts In-Stock

1+ parts

$27.102

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$27.102

-

-

-

Corphita

USA . 326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

326

-

-

-

-

Parana Technologies

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$17.233

1k+ parts

-

10k+ parts

-

26

-

$17.233

-

-

Overview

Elevate your telecom projects with the LCDP1521 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust surge protection IC is designed to safeguard your electronic systems, ensuring reliability even in extreme conditions. With its compact size and superior quality, the LCDP1521 effortlessly integrates into various applications, delivering peace of mind and long-term performance. Choose STMicroelectronics for unmatched expertise and innovation in every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides excellent insulation and protection against environmental factors, making it a durable choice for telecom applications.

Surface Mount: YES

Being a surface mount component allows for easier PCB assembly and reduces assembly costs, making it suitable for modern manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating efficient layout design and integration with other components.

No. of Terminals: 8

With 8 terminals, this IC provides ample connectivity options, enhancing versatility for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs, which is crucial for high-density telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in demanding environments, suitable for industrial and outdoor applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is capable of functioning in extreme cold conditions, ensuring reliability in various climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This premium terminal finish provides superior corrosion resistance and excellent electrical conductivity, enhancing overall performance and longevity.

Terminal Position: DUAL

Dual terminal positions facilitate easier PCB layout and allow for flexible design configurations in complex circuits.

Maximum Seated Height: 1.75 mm

The low seated height is advantageous for space-constrained applications, allowing for thinner PCB designs.

Width: 3.9 mm

This compact width ensures efficient use of board space, making it ideal for small form factor devices.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds guarantees stable performance during the soldering process, minimizing the risk of thermal damage.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature enables compatibility with various soldering techniques, increasing manufacturing flexibility.

Length: 4.9 mm

The compact length assists in designing smaller and more efficient PCBs, which is essential for modern telecom devices.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade ensures reliability and performance in harsh operating conditions, making it suitable for critical applications.

Terminal Form: GULL WING

The gull wing terminal form aids in soldering and provides mechanical stability, enhancing durability on the PCB.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC is crucial for safeguarding sensitive telecom equipment from voltage spikes, significantly improving the longevity and reliability of devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of handling, suitable for a variety of PCB layouts.

Technical Specifications

Telecom - Protection ICs LCDP1521 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

LCDP1521 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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