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SMP100MC-120

STMicroelectronics

SMP100MC-120 by STMicroelectronics

SMP100MC-120 by STMicroelectronics is a compact surge protection circuit designed for telecom applications. It features a dual terminal design with a max height of 2.65 mm and dimensions of 3.625 mm x 4.325 mm, ensuring efficient space utilization. This surface-mount IC offers robust protection against voltage spikes in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,782 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,782

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-

-

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Digiode

USA . 1,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,445

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-

-

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Anansix

USA . 770 parts In-Stock

1+ parts

-

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-

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770

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,187 parts In-Stock

1+ parts

$10.149

100+ parts

-

1k+ parts

$9.134

10k+ parts

-

2,187

$10.149

-

$9.134

-

MKK Technologies

India . 797 parts In-Stock

1+ parts

$19.084

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$19.084

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-

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DigiPath Technology Company

USA . 797 parts In-Stock

1+ parts

$19.084

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$19.084

-

-

-

Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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7,500

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-

-

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Parana Technologies

USA . 1,984 parts In-Stock

1+ parts

-

100+ parts

$12.134

1k+ parts

-

10k+ parts

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1,984

-

$12.134

-

-

Corphita

USA . 430 parts In-Stock

1+ parts

-

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1k+ parts

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430

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Overview

Elevate your telecom systems with the SMP100MC-120 from STMicroelectronics, a leader in cutting-edge protection ICs. Crafted to safeguard your devices against surges, this compact and reliable solution ensures uninterrupted performance while enhancing the longevity of your equipment. With its robust design and dual-terminal configuration, it excels in diverse applications, delivering peace of mind and unparalleled value for your investment. Trust STMicroelectronics for quality that empowers your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures excellent durability and resistance to environmental factors, making this product reliable for telecom applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern PCB designs, saving space and improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape is ideal for compact layouts in telecom equipment, allowing for space-efficient arrangements on circuit boards.

No. of Terminals: 2

With only two terminals, this IC simplifies circuitry and promotes straightforward connections and layout design.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a smaller footprint, making it suitable for densely packed electronics typical in telecom devices.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing the longevity and performance of the connection.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in implementation, allowing for better routing options on the PCB.

Maximum Seated Height: 2.65 mm

The low maximum seated height ensures compatibility with low-profile designs, contributing to slimmer devices in the telecom industry.

Width: 3.625 mm

A width of 3.625 mm allows for efficient use of PCB space while accommodating routing for adjacent components.

Length: 4.325 mm

The length of 4.325 mm provides a balanced size for easy handling and optimized layout in compact telecom applications.

Terminal Form: C BEND

C bend terminal form ensures a secure mechanical connection and contributes to reliable electrical performance in telecom circuits.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC is essential for safeguarding sensitive telecom equipment from voltage spikes and enhances the durability of the overall system.

Technical Specifications

Telecom - Protection ICs SMP100MC-120 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Length:

4.325 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Width:

3.625 mm

Trade Compliance

SMP100MC-120 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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