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SMP100MC-360

STMicroelectronics

SMP100MC-360 by STMicroelectronics

SMP100MC-360 by STMicroelectronics is a compact surge protection circuit designed for telecom applications. It features a small outline package with dual terminals, measuring 4.325 mm in length and 3.625 mm in width. This device ensures reliable protection against voltage spikes while maintaining a max seated height of just 2.65 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,388 parts In-Stock

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4,388

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Vyrian

USA . 2,238 parts In-Stock

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2,238

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Anansix

USA . 1,297 parts In-Stock

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1,297

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Distributors (Availability)

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$15.330

100+ parts

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664

$15.330

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IDEA Electronic Components Group

UK . 468 parts In-Stock

1+ parts

$15.726

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-

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$14.154

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468

$15.726

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$14.154

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MKK Technologies

India . 939 parts In-Stock

1+ parts

$29.573

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939

$29.573

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DigiPath Technology Company

USA . 939 parts In-Stock

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$29.573

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939

$29.573

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Component Stockers USA

USA . 575 parts In-Stock

1+ parts

$99.990

100+ parts

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575

$99.990

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A-Z Elektronik GmbH

Germany . 4,893 parts In-Stock

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4,893

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,219 parts In-Stock

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$18.803

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2,219

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$18.803

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Corphita

USA . 2,170 parts In-Stock

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2,170

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock unparalleled reliability with the SMP100MC-360 from STMicroelectronics, your trusted partner in advanced telecom solutions. This top-tier surge protection IC safeguards critical systems, ensuring uninterrupted service and enhanced device longevity. Its compact design seamlessly integrates into various applications, delivering unmatched performance without compromising space. Choose quality and innovation—experience the peace of mind that comes with STMicroelectronics' superior engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials offers excellent durability and protection against environmental factors, making it ideal for telecommunications applications.

Surface Mount: YES

Being a surface mount device allows for more efficient use of board space and ensures ease of assembly in automated processes.

Package Shape: RECTANGULAR

The rectangular package shape contributes to better thermal performance and efficient use of PCB layout space.

No. of Terminals: 2

Having two terminals simplifies the installation process and is suitable for various compact applications.

Package Style (Meter): SMALL OUTLINE

The small outline design helps to reduce the overall footprint on the PCB, allowing for higher component density and saving space.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides reliable connections, ensuring dependable performance in critical telecom environments.

Terminal Position: DUAL

The dual terminal configuration allows for versatile connections and simplifies circuit design for surge protection.

Maximum Seated Height: 2.65 mm

The low profile of 2.65 mm helps in achieving a slim design, making it suitable for space-constrained applications.

Width: 3.625 mm

A compact width of 3.625 mm permits easy integration into tight layouts without compromising the electrical performance.

Length: 4.325 mm

The manageable length of 4.325 mm ensures compatibility with a variety of circuit configurations while maintaining a small footprint.

Terminal Form: C BEND

The C bend terminals provide secure soldering and excellent mechanical strength, enhancing durability in the installed position.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC is essential for safeguarding sensitive telecommunications equipment from voltage spikes and transients.

Technical Specifications

Telecom - Protection ICs SMP100MC-360 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Length:

4.325 mm

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Width:

3.625 mm

Trade Compliance

SMP100MC-360 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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