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SMP1100SCMC

STMicroelectronics

SMP1100SCMC by STMicroelectronics

SMP1100SCMC by STMicroelectronics is a Telecom IC with surge protection circuit. It comes in a small outline package measuring 3.625mm in width and 4.325mm in length, with a max seated height of 2.65mm. This surface-mount device has dual terminal positions and is designed for telecom applications requiring protection against surges.

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,822 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.438

3,822

-

-

-

$0.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,230 parts In-Stock

1+ parts

$0.438

100+ parts

-

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10k+ parts

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1,230

$0.438

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Anansix

USA . 1,844 parts In-Stock

1+ parts

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1,844

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Digiode

USA . 676 parts In-Stock

1+ parts

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676

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 661 parts In-Stock

1+ parts

$10.746

100+ parts

-

1k+ parts

$9.671

10k+ parts

-

661

$10.746

-

$9.671

-

MKK Technologies

India . 2,228 parts In-Stock

1+ parts

$20.206

100+ parts

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2,228

$20.206

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DigiPath Technology Company

USA . 2,228 parts In-Stock

1+ parts

$20.206

100+ parts

-

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10k+ parts

-

2,228

$20.206

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-

-

Kepictronics

USA . 85,000 parts In-Stock

1+ parts

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85,000

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Perfect Parts

USA . 4,256 parts In-Stock

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4,256

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Parana Technologies

USA . 2,229 parts In-Stock

1+ parts

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100+ parts

$12.848

1k+ parts

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2,229

-

$12.848

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Corphita

USA . 113 parts In-Stock

1+ parts

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113

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Overview

Protect your valuable telecom equipment with the SMP1100SCMC surge protection circuit from STMicroelectronics. With a reputation for excellence in manufacturing, STMicroelectronics delivers top-quality products to ensure the safety and reliability of your devices. This compact, surface-mount device offers peace of mind by safeguarding against power surges, ensuring uninterrupted communication and optimal performance. Trust STMicroelectronics to provide superior protection for your telecom systems with the SMP1100SCMC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making this product easy to handle and resistant to wear and tear.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape of the package helps in saving space on the circuit board, allowing for more compact designs.

No. of Terminals: 2

Having only 2 terminals simplifies the installation process and reduces the chance of errors during connection.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for higher component density, making it suitable for compact electronic devices.

Terminal Position: DUAL

Dual terminal position provides flexibility for different types of installations and allows for easy connectivity in various configurations.

Maximum Seated Height: 2.65 mm

Low seated height helps in reducing the overall profile of the product, making it suitable for slim electronic devices.

Width: 3.625 mm

Compact width dimension allows for space-efficient placement on the circuit board, facilitating a more streamlined design.

Length: 4.325 mm

The length dimension is optimal for fitting into tight spaces, ensuring that the product can be integrated into various electronic applications.

Terminal Form: C BEND

The C bend terminal form provides secure and reliable connections, reducing the risk of disconnection or signal interference.

Telecom IC Type: SURGE PROTECTION CIRCUIT

With surge protection circuitry, this product offers added protection to telecom equipment against voltage spikes and surges, ensuring reliability and longevity of the devices.

Technical Specifications

Telecom - Protection ICs SMP1100SCMC attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

Length:

4.325 mm

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.625 mm

Trade Compliance

SMP1100SCMC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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