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SMP100MC-320

STMicroelectronics

SMP100MC-320 by STMicroelectronics

SMP100MC-320 by STMicroelectronics is a compact surge protection circuit designed for telecom applications. It features a dual terminal configuration, with a max seated height of 2.65 mm and dimensions of 3.625 mm x 4.325 mm. This surface-mount IC ensures reliable protection against voltage spikes in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 25,000 parts In-Stock

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Vyrian

USA . 4,433 parts In-Stock

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4,433

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Digiode

USA . 3,729 parts In-Stock

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3,729

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Bristol Electronics

USA . 1,818 parts In-Stock

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Dan-Mar Components

USA . 1,818 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,300 parts In-Stock

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Anansix

USA . 1,140 parts In-Stock

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Rebound Electronics

UK . 150 parts In-Stock

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150

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IDEA Electronic Components Group

UK . 1,810 parts In-Stock

1+ parts

$6.151

100+ parts

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$5.536

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$6.151

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$5.536

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AZTECH Wire

Italy . 568 parts In-Stock

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$10.610

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568

$10.610

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MKK Technologies

India . 948 parts In-Stock

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$11.567

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948

$11.567

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DigiPath Technology Company

USA . 948 parts In-Stock

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$11.567

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948

$11.567

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Kepictronics

USA . 88,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,822 parts In-Stock

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Perfect Parts

USA . 2,221 parts In-Stock

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Parana Technologies

USA . 1,986 parts In-Stock

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$7.355

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$7.355

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Corphita

USA . 968 parts In-Stock

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Overview

Elevate your telecom designs with the SMP100MC-320 from STMicroelectronics, a leader in innovation and reliability. This robust surge protection IC ensures unparalleled defense against voltage spikes, enhancing the longevity of your devices. Its compact design fits seamlessly into various applications, making it perfect for today’s fast-paced tech environment. Choose STMicroelectronics for quality and performance that empower your projects and safeguard your investments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it ideal for rigorous telecom applications.

Surface Mount: YES

Being a surface mount device allows for easy integration into compact circuit designs, saving space on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized footprint that is compatible with most PCB layouts, facilitating efficient design and manufacturing.

No. of Terminals: 2

Having two terminals makes this IC straightforward to use in simple surge protection circuits without complicating the circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables high-density applications, making it suitable for modern, compact electronic devices.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures excellent solderability and corrosion resistance, enhancing the longevity and reliability of the device.

Terminal Position: DUAL

Dual terminal positioning is advantageous for easy connection in applications requiring surge protection, ensuring stable performance.

Maximum Seated Height: 2.65 mm

A low maximum seated height allows for a slim profile, making it ideal for height-constrained PCB spaces while still maintaining performance.

Width: 3.625 mm

The compact width of the component helps to optimize layout space on PCBs, ensuring better design flexibility.

Length: 4.325 mm

This length is carefully designed to balance between performance and size, ensuring it's effective for surge protection without taking up excessive board space.

Terminal Form: C BEND

The C bend terminal form helps in effective mounting and stabilizes the IC during operation, improving overall reliability.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC is essential for safeguarding sensitive telecom equipment against voltage spikes, ensuring the longevity of the system.

Technical Specifications

Telecom - Protection ICs SMP100MC-320 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Length:

4.325 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Width:

3.625 mm

Trade Compliance

SMP100MC-320 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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