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TISP6NTP2BDR

Texas Instruments

TISP6NTP2BDR by Texas Instruments

TISP6NTP2BDR by Texas Instruments is a Telecom Surge Protection Circuit with 8 terminals, operating temperature range of -40 to 85°C. It comes in a small outline package style, suitable for telecom applications requiring protection against surges. The device features gull wing terminal form and compact dimensions of 3.9mm width, 4.9mm length, and 1.75mm seated height.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,624 parts In-Stock

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Vyrian

USA . 2,365 parts In-Stock

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2,365

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PC Components Company LLC

USA . 514 parts In-Stock

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514

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Bristol Electronics

USA . 514 parts In-Stock

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514

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 256 parts In-Stock

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256

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Distributors (Availability)

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AZTECH Wire

Italy . 610 parts In-Stock

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$5.623

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610

$5.623

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Parana Technologies

USA . 388 parts In-Stock

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$12.245

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$12.667

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388

$12.245

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DigiPath Technology Company

USA . 580 parts In-Stock

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$13.483

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$12.404

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580

$13.483

$12.404

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ChromeModa Solutions

Germany . 2,405 parts In-Stock

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$13.758

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$11.282

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$13.758

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IDEA Electronic Components Group

UK . 848 parts In-Stock

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$13.758

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$13.070

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$12.382

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848

$13.758

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$12.382

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One Stop Electronics

USA . 1,590 parts In-Stock

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$838.000

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$838.000

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Assy Fe

Spain . 2,480 parts In-Stock

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Corphita

USA . 1,205 parts In-Stock

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Overview

Upgrade your telecom systems with the TISP6NTP2BDR by Texas Instruments, a high-quality surge protection circuit designed to safeguard your equipment from voltage spikes and surges. Manufactured by industry leader Texas Instruments, this Telecom - Protection IC offers exceptional reliability and performance in a compact small outline package. Ensure the longevity of your telecommunications infrastructure with this advanced solution that provides peace of mind and protection for your valuable assets.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, making it suitable for telecom applications where reliability is critical.

Surface Mount: YES

Allows for easy integration onto printed circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Facilitates efficient placement and alignment on the PCB, optimizing the use of available space.

No. of Terminals: 8

Sufficient number of terminals for connectivity and functionality, enhancing the versatility of the IC.

Package Style (Meter): SMALL OUTLINE

Compact form factor makes it ideal for space-constrained telecom devices, enabling sleek and efficient designs.

Maximum Operating Temperature: 85 °C

Withstands high temperatures commonly encountered in industrial environments, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures, making it suitable for telecom equipment deployed in diverse environmental settings.

Terminal Position: DUAL

Dual terminal configuration enhances connectivity options and improves electrical characteristics for better signal transmission.

Maximum Seated Height: 1.75 mm

Low profile design aids in minimizing the overall height of the IC assembly, contributing to the compactness of the final product.

Width: 3.9 mm

Narrow width facilitates efficient use of board space, allowing for compact layouts in telecom devices.

Length: 4.9 mm

Compact length dimension contributes to the overall small footprint of the IC, enabling space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to meet the rigors of industrial environments, ensuring reliable operation in demanding telecom applications.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical connections and ease of soldering during assembly, enhancing overall product reliability.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Specifically designed for surge protection in telecom systems, offering enhanced protection against voltage spikes and disturbances.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for convenient soldering and board layout, facilitating smooth integration into telecom circuitry.

Technical Specifications

Telecom - Protection ICs TISP6NTP2BDR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP6NTP2BDR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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