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SMP1500SCMC

STMicroelectronics

SMP1500SCMC by STMicroelectronics

SMP1500SCMC by STMicroelectronics is a Telecom IC with surge protection circuit. It comes in a small outline package, 2 terminals, and C bend terminal form. Ideal for telecom applications requiring surface mount protection with compact dimensions (L: 4.325mm, W: 3.625mm, H: 2.65mm).

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.438

1,275

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-

$0.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,585 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

-

10k+ parts

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2,585

$0.438

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Nova Conductors

Japan . 75 parts In-Stock

1+ parts

$0.614

100+ parts

-

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75

$0.614

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-

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Anansix

USA . 989 parts In-Stock

1+ parts

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1k+ parts

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989

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Digiode

USA . 746 parts In-Stock

1+ parts

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746

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,202 parts In-Stock

1+ parts

$15.084

100+ parts

-

1k+ parts

$13.576

10k+ parts

-

1,202

$15.084

-

$13.576

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MKK Technologies

India . 1,177 parts In-Stock

1+ parts

$28.365

100+ parts

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1,177

$28.365

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DigiPath Technology Company

USA . 1,177 parts In-Stock

1+ parts

$28.365

100+ parts

-

1k+ parts

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10k+ parts

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1,177

$28.365

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Kepictronics

USA . 85,000 parts In-Stock

1+ parts

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85,000

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Perfect Parts

USA . 8,232 parts In-Stock

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8,232

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Corphita

USA . 805 parts In-Stock

1+ parts

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805

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Parana Technologies

USA . 241 parts In-Stock

1+ parts

-

100+ parts

$18.036

1k+ parts

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10k+ parts

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241

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$18.036

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-

Overview

Upgrade your telecom systems with the SMP1500SCMC surge protection circuit by STMicroelectronics. Designed with precision and reliability in mind, this small outline package offers superior protection for your telecommunications devices. With a dual terminal position and plastic/epoxy body material, this product ensures optimal performance in a compact design. Keep your equipment safe from power surges and voltage spikes with this high-quality solution. Trust STMicroelectronics to deliver excellence in every aspect of your technology needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Enables easy integration into existing circuit designs and layouts.

No. of Terminals: 2

Simplifies the connection process and reduces the chances of errors during installation.

Package Style: SMALL OUTLINE

Facilitates space-saving on the PCB, making it suitable for compact designs.

Terminal Position: DUAL

Allows for flexibility in connecting the IC to other components, enhancing compatibility.

Maximum Seated Height: 2.65 mm

Fits well within the dimensions of most electronic devices, making it versatile for various applications.

Width: 3.625 mm

Compact size enables it to be used in space-constrained environments without sacrificing performance.

Length: 4.325 mm

Optimal dimensions for easy integration and fitting within the circuit layout.

Terminal Form: C BEND

Ensures secure and stable connections, reducing the risk of disconnections or malfunctions.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Provides crucial protection against power surges, ensuring the safety and reliability of the telecom equipment.

Technical Specifications

Telecom - Protection ICs SMP1500SCMC attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

Length:

4.325 mm

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.625 mm

Trade Compliance

SMP1500SCMC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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