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TISP6NTP2AD

Texas Instruments

TISP6NTP2AD by Texas Instruments

TISP6NTP2AD by Texas Instruments is a Telecom Surge Protection Circuit with 2 functions. It comes in a small outline package, suitable for surface mount applications. Operating temperature ranges from -40 to 85°C, making it ideal for industrial telecom systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 3,780 parts In-Stock

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3,780

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Vyrian

USA . 2,303 parts In-Stock

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2,303

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Legend Electronics Inc.

USA . 1,575 parts In-Stock

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1,575

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Digiode

USA . 608 parts In-Stock

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608

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Distributors (Availability)

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Parana Technologies

USA . 1,126 parts In-Stock

1+ parts

$12.273

100+ parts

-

1k+ parts

$12.699

10k+ parts

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1,126

$12.273

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$12.699

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ChromeModa Solutions

Germany . 2,350 parts In-Stock

1+ parts

$13.790

100+ parts

$11.308

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2,350

$13.790

$11.308

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

1+ parts

$13.790

100+ parts

$13.100

1k+ parts

$12.411

10k+ parts

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1,295

$13.790

$13.100

$12.411

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AZTECH Wire

Italy . 891 parts In-Stock

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$14.208

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891

$14.208

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One Stop Electronics

USA . 1,110 parts In-Stock

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$777.000

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1,110

$777.000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 1,092 parts In-Stock

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1,092

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DigiPath Technology Company

USA . 719 parts In-Stock

1+ parts

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$12.433

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719

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$12.433

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Overview

Upgrade your telecom systems with the TISP6NTP2AD surge protection circuit by Texas Instruments. With a focus on quality and reliability, Texas Instruments offers top-notch protection ICs that ensure the safety and longevity of your equipment. Ideal for telecommunications applications, this compact and efficient device provides peace of mind against voltage surges and spikes. Trust Texas Instruments to deliver superior performance and protection for your telecom systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

The multiple functions offered by this IC provide enhanced protection for telecom equipment, improving overall performance and reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 8

The higher number of terminals provides more connections for enhanced functionality and integration with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact telecom devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can function reliably even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to operate effectively in a wide range of temperature environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and allow for different configurations to suit specific application requirements.

Maximum Seated Height: 1.75 mm

The low seated height makes the IC suitable for slim and compact telecom devices, saving space in the overall design.

Width: 3.905 mm

The compact width of the IC enables easy integration into space-constrained telecom equipment without compromising performance.

Length: 4.9 mm

The short length of the IC offers design flexibility and allows for efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding industrial settings, making it suitable for telecom applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during installation, enhancing the overall reliability of the IC.

Telecom IC Type: SURGE PROTECTION CIRCUIT

The surge protection circuit type helps safeguard telecom equipment from power surges and voltage fluctuations, protecting against damage and downtime.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting, enabling efficient use of space on the circuit board and enhancing overall design flexibility.

Technical Specifications

Telecom - Protection ICs TISP6NTP2AD attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.905 mm

Trade Compliance

TISP6NTP2AD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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