Loading...

SMP100MC-90

STMicroelectronics

SMP100MC-90 by STMicroelectronics

SMP100MC-90 by STMicroelectronics is a compact surge protection circuit designed for telecom applications. It features a dual terminal configuration with a max height of 2.65 mm and dimensions of 3.625 mm x 4.325 mm, ensuring efficient space utilization. This surface-mount IC provides reliable protection against voltage spikes in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,070

-

-

-

-

Anansix

USA . 806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

806

-

-

-

-

Vyrian

USA . 789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

789

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,930 parts In-Stock

1+ parts

$9.685

100+ parts

-

1k+ parts

$8.716

10k+ parts

-

1,930

$9.685

-

$8.716

-

MKK Technologies

India . 1,141 parts In-Stock

1+ parts

$18.212

100+ parts

-

1k+ parts

-

10k+ parts

-

1,141

$18.212

-

-

-

DigiPath Technology Company

USA . 1,141 parts In-Stock

1+ parts

$18.212

100+ parts

-

1k+ parts

-

10k+ parts

-

1,141

$18.212

-

-

-

Corphita

USA . 1,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,522

-

-

-

-

Parana Technologies

USA . 778 parts In-Stock

1+ parts

-

100+ parts

$11.580

1k+ parts

-

10k+ parts

-

778

-

$11.580

-

-

Overview

Elevate your telecom systems with the SMP100MC-90 from STMicroelectronics, a trusted leader in high-quality protection ICs. Designed for superior surge protection, this compact solution ensures reliable performance while safeguarding your devices. Its robust construction and advanced technology make it ideal for demanding applications, delivering unmatched value and peace of mind. Choose STMicroelectronics for innovation that empowers your connectivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective, while providing adequate protection against environmental factors.

Surface Mount: YES

Being a surface mount device allows for easier integration into modern PCB designs, promoting space efficiency and automated assembly.

Package Shape: RECTANGULAR

The rectangular shape aids in optimal space utilization on circuit boards, enhancing design flexibility.

No. of Terminals: 2

Having only 2 terminals simplifies installation and reduces potential points of failure, making it reliable for use in critical applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint on the PCB, allowing for compact design layouts in telecom applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-term durability in various environments.

Terminal Position: DUAL

The dual terminal positioning enables easy access for circuit connections, facilitating straightforward integration into existing designs.

Maximum Seated Height: 2.65 mm

A maximum seated height of just 2.65 mm contributes to low-profile designs, essential for space-constrained applications.

Width: 3.625 mm

The compact width allows this protection IC to fit easily into dense circuit layouts without compromising functionality.

Length: 4.325 mm

This specific length helps in achieving a well-balanced component layout on the PCB, which can improve overall circuit performance.

Terminal Form: C BEND

C bend terminals promote superior mechanical stability and facilitate secure connections to the PCB, enhancing reliability during operation.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC is essential for safeguarding telecom equipment from voltage spikes, thereby ensuring device longevity and reliability.

Technical Specifications

Telecom - Protection ICs SMP100MC-90 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Length:

4.325 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Width:

3.625 mm

Trade Compliance

SMP100MC-90 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 14